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Datasheet: SOT23-5 (Zetex Semiconductors)

Surface Mounted, 5 Pin Package

 

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Zetex Semiconductors
Issue 1 - September 2005
1
www.zetex.com
Zetex Semiconductors plc 2005
Package information - SOT23-5
Surface mounted, 5 pin package
Package outline
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
DIM
Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.90
1.45
0.0354
0.0570
A1
0.00
0.15
0.00
0.0059
A2
0.90
1.30
0.0354
0.0511
b
0.20
0.50
0.0078
0.0196
C
0.09
0.26
0.0035
0.0102
D
2.70
3.10
0.1062
0.1220
E
2.20
3.20
0.0866
0.1181
E1
1.30
1.80
0.0511
0.0708
e
0.95 REF
0.0374 REF
e1
1.90 REF
0.0748 REF
L
0.10
0.60
0.0039
0.0236
a
0
30
0
30
2.2
0.087
0.95
0.375
1.06
0.042
0.65
0.025
mm
inches
Package information - SOT23-5
Issue 1 - September 2005
2
www.zetex.com
Zetex Semiconductors plc 2005
Nominal weight
Nominal weight per device 12mg.
Tape and reel information
Embossed carrier tape configuration
Orientation
Tape width
(mm)
Reel size
(inches)
No. of
components
Tape option
indicator
8
7
3,000
TA
8
13
10,000
TC
Dimensions
mm (inches)
Tape size (mm)
8
12
16
24
A0, B0, K0
See note
*
NOTES:
* A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements
(see fig. 1).
See note
*
See note
*
See note
*
B1 (max.)
4.55 (0.179)
8.20 (0.323)
12.10 (0.476)
20.10 (0.791)
D
1.50 + 0.10 - 0.00
1.50 + 0.10 - 0.00
1.50 + 0.10 - 0.00
1.50 + 0.10 - 0.00
D1 (max.)
1.00 (0.039)
1.50 (0.059)
1.50 (0.059)
1.50 (0.059)
E
1.75 0.10
1.75 0.10
1.75 0.10
1.75 0.10
F
3.50 0.10
(0.138 0.004)
5.50 0.05
(0.217 0.002)
7.50 0.10
(0.295 0.004)
11.50 0.10
(0.453 0.004)
P
4.00 0.10
(0.157 0.004)
4.00 0.10
(0.157 0.004)
8.00 0.10
(0.315 0.004)
4.00 0.10
(0.157 0.004)
8.00 0.10
(0.315 0.004)
12.00 0.10
(0.472 0.004)
4.00 0.10
(0.157 0.004)
to 20.00 0.10
(0.787 0.004)
in 4.00 (0.157)
increments
P0
4.00 0.10
4.00 0.10
4.00 0.10
4.00 0.10
P2
2.00 0.05
2.00 0.05
2.00 0.05
2.00 0.05
t (max.)
0.40
0.40
0.40
0.40
W
8.00 (0.315)
12.00 0.30
(0.472 0.012)
16.30 (0.642)
24.30 (0.957)
D
K
t
P0
P2
A0
B0
P
Center lines
of cavity
10 pitches culmulative
tolerance on tape
0.2mm (0.008")
User direction of feed
Embossment
Top cover
tape
K0
B1
See Note 1
See Note 1
See Note 1
D1
W
F
E
Package information - SOT23-5
Issue 1 - September 2005
3
www.zetex.com
Zetex Semiconductors plc 2005
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Figure 1 - rotational and lateral movement
Reel configuration
Tape
size
A (max.)
B
(min.)
C
D
(min.)
N
(min.)
G
T
(max.)
8mm
179
(7.047)
1.5
(0.06)
13.00 0.02
(0.512 0.008)
25.0
(0.984)
50
(1.969)
8.4 +1.5 0.0
(0.33 +0.06 0.00)
14.4
(0.567)
12mm
330
(12.992)
1.5
(0.06)
13.00 0.02
(0.512 0.008)
20.2
(0.795)
50
(1.969)
12.4 +2.0 0.0
(0.49 +0.079 0.00)
18.4
(0.724)
16mm
330
(12.992)
1.5
(0.06)
13.00 0.02
(0.512 0.008)
20.2
(0.795)
50
(1.969)
16.4 +2.0 0.0
(0.65 +0.079 0.00)
22.4
(0.882)
24mm
330
(12.992)
1.5
(0.06)
13.00 0.02
(0.512 0.008)
20.2
(0.795)
60
(2.362)
24.4 +2.0 0.0
(0.96 +0.079 0.00)
30.4
(1.197)
20 maximum
0.5mm
maximum
0.5mm
maximum
Component
lateral movement
Component
cavity
center line
20 maximum
Component
center line
B0
A0
Component rotation - top view
Component rotation - side view
Full radius
Tape slot in core
for tape start.
2.5mm min. width,
10mm min. depth
G
T
N
C
D
A
B
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