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Datasheet: ECG003B-PCB (WJ Communications)

InGaP HBT Gain Block

 

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WJ Communications
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
September
2004
ECG003
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
Product Features
DC 6 GHz
+24 dBm P1dB at 1 GHz
+39 dBm OIP3 at 1 GHz
20 dB Gain at 1 GHz
3.6 dB Noise Figure at 2 GHz
SOT-89 Package and lead-free
/ green SOT-89
Internally matched to 50
Applications
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
Product Description
The ECG003 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG003 typically provides 20
dB of gain, +39 dBm Output IP3, and +24 dBm P1dB.
The ECG003 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in a low-
cost, surface-mountable SOT-89 package. ECG003 is also
available in a lead-free/green/RoHS-compliant SOT-89
package All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG003 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and fixed
wireless.

Functional Diagram
RF IN
GND
RF OUT
GND
1
2
3
4
ECG003B / ECG003B-G
Specifications
(1)
Parameter
Units Min Typ Max
Operational Bandwidth
MHz
DC
6000
Test Frequency
MHz
1000
Gain
dB 20
Output P1dB
dBm
+24
Output IP3
(3)
dBm
+39
Noise Figure
dB 3.5
Test Frequency
MHz
2000
Gain
dB
18
19
Input
Return
Loss
dB 15
Output Return Loss
dB
10
Output P1dB
dBm
+23
Output IP3
(2)
dBm
+34
+36
Noise
Figure
dB 3.6
Device
Voltage
V 6.7 7.2 7.6
Device Current
mA
110
Output mismatch w/o spurs
VSWR
10:1

1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +9 V, R
bias
= 16
, 50 System.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

Absolute Maximum Rating
Parameter
Rating
Operating Case Temperature
-40 to +85
C
Storage Temperature
-65 to +150
C
RF Input Power (continuous)
+10 dBm
Device Current
160 mA
Junction Temperature
+250
C
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance
(3)
Parameter
Units
Typical
Frequency MHz
500
900
1900
2140
S21 dB
21
20
19
18.7
S11
dB -19 -18 -16 -15
S22
dB -14 -13 -10 -10
Output P1dB
dBm
+24.4
+24
+23
+22.5
Output IP3
dBm
+39
+39
+36
+35
Noise
Figure
dB 3.5 3.5 3.6 3.7
3. Test conditions: T = 25 C, Supply Voltage = +9 V, Device Voltage = +7.2V, R
bias
= 16
, 50 System.








Ordering Information
Part No.
Description
ECG003B
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
ECG003B-G
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG003B-PCB
700 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
September
2004
ECG003
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
Typical Device RF Performance
(3)
Supply Bias = +9 V, R
bias
= 16
, I
cc
= 110 mA
Frequency
MHz
100
500
900
1900
2140
2400
3500
5800
S21
dB 21 21 20.4 19 18.7 18.2 17.4 14
S11
dB -20 -19 -18 -16 -15 -13 -12 -6
S22
dB -15 -14 -13 -10 -10 -8 -7 -3
Output P1dB
dBm
+24.4 +24.4
+24 +23 +22.5
+20.5
+18.7 12
Output IP3
dBm
+38
+39
+39 +36 +35 +34 +31
Noise
Figure dB 3.9 3.6 3.5 3.6 3.7 3.7 4.2

1. Test conditions: T = 25 C, Supply Voltage = +9 V, Device Voltage = 7.2 V, Rbias = 16
, Icc = 110 mA typical, 50 System.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not
account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gain vs. Frequency
14
16
18
20
22
500
1000
1500
2000
2500
3000
Frequency (MHz)
Gain
(
dB
)
+25C
-40C
+85C
S11, S22 vs. Frequency
-25
-20
-15
-10
-5
0
0
1
2
3
4
5
6
Frequency (GHz)
S11
S22
Icc vs. Vde
0
20
40
60
80
100
120
140
0.0
2.0
4.0
6.0
8.0
10.0
Vde (V)
Icc
(
mA
)
+25C
OIP3 vs. Frequency
25
30
35
40
45
500
1000
1500
2000
2500
3000
Frequency (MHz)
OIP3
(
dBm
)
+25C
-40C
+85C
Noise Figure vs. Frequency
1.5
2
2.5
3
3.5
4
500
1000
1500
2000
Frequency (MHz)
NF
(
dB
)
P1dB vs. Frequency
10
15
20
25
30
500
1000
1500
2000
2500
3000
Frequency (MHz)
P1d
B

(
dBm
)
+25C
-40C
-85C
S-Parameters (V
device
= +7.2 V, I
CC
= 110 mA, T = 25
C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50 -20.36 -0.18 20.46 177.69 -23.19 -0.38 -13.95 -2.86
500 -19.29 -24.13 20.19 157.68 -23.08 -2.33 -13.44 -35.26
1000 -17.78 -51.50 19.84 136.88 -22.93 -4.52 -12.45 -68.47
1500 -16.23 -75.63 19.40 117.06 -22.61 -7.13 -11.26 -97.26
2000 -14.71 -98.28 19.06 97.71 -22.16 -9.76 -9.96 -123.04
2500 -13.16 -118.71 18.65 78.13 -21.61 -13.40 -8.82 -145.90
3000 -12.14 -139.91 18.23 59.26 -20.91 -17.67 -7.63 -167.85
3500 -11.24 -161.53 17.77 40.27 -20.11 -23.92 -6.59 171.00
4000 -10.30 174.59 17.32 20.70 -19.35 -31.44 -5.32 150.44
4500 -9.20 147.71 16.71 0.41 -18.62 -41.28 -4.19 128.81
5000 -7.76 120.30 15.97 -19.87 -18.16 -52.98 -3.10 107.78
5500 -6.63 92.76 14.85 -40.81 -18.05 -66.03 -2.28 87.09
6000 -5.54 70.28 13.49 -59.45 -18.34 -79.15 -1.78 67.70
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
September
2004
ECG003
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
Recommended Application Circuit
Recommended Component Values
Reference
Frequency (MHz)
Designator
50
500 900 1900 2200 2500 3500
L1
820 nH
220 nH
68 nH
27 nH
22 nH
18 nH
15 nH
C1, C2, C4
.018 F
1000 pF
100 pF
68 pF
68 pF
56 pF
39 pF

1. The proper values for the components are dependent upon the intended frequency of operation.
2. The component values in the table below are contained on the evaluation board to achieve optimal broadband
performance.
3. R2 and R3 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures
of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to
degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of
this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz.
Ref. Desig.
Value / Type
Size
L1
39 nH wirewound inductor
0603
C1, C2
56 pF chip capacitor
0603
C3
0.018
F chip capacitor
0603
C4
Do Not Place
R2
18
chip resistor
0603
R3
4.7
chip resistor
0603
R4
16
1% tolerance
2010

Recommended Bias Resistor Values
Supply
Voltage
R1 value
Size
9 V
16 ohms
2010
10 V
25 ohms
2512
12 V
44 ohms
2512
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +9 V.
A
1% tolerance resistor is recommended.
ECG003B-PCB Performance Data
(WJ's evaluation board uses the circuit shown above.)
Gain
10
12
14
16
18
20
0
1
2
3
4
Frequency (GHz)
Return Loss
-30
-20
-10
0
0
1
2
3
4
Frequency (GHz)
S11
S22
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 F
R4
Bias
Resistor
RF IN
C4
Bypass
Capacitor
C2
Blocking
Capacitor
Vcc
Icc = 110 mA
ECG003B
R2
18
R3
4.7
R2
R3
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
September
2004
ECG003
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
ECG003B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Product Marking

The component will be marked with an
"E003" designator with an alphanumeric lot
code on the top surface of the package.

Tape and reel specifications for this part are
located on the website in the "Application
Notes" section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135") diameter drill and have a final plated
thru diameter of .25 mm (.010").
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.











Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
September
2004
ECG003
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
ECG003B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
C reflow temperature) and leaded
(maximum 245
C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking

The component will be marked with an
"E003G" designator with an alphanumeric lot
code on the top surface of the package.

Tape and reel specifications for this part are
located on the website in the "Application
Notes" section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135") diameter drill and have a final plated
thru diameter of .25 mm (.010").
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
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