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Datasheet: AH210 (WJ Communications)

 

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WJ Communications

Document Outline

This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
April
2003
The Communications Edge
TM
AH210
1 Watt, High Gain HBT Amplifier
Preliminary Product Information
Product Features
1500 2300 MHz
25 dB Gain @ 1960 MHz
+30 dBm P1dB
+49 dBm Output IP3
Single Positive Supply (+5 V)
SOIC-8 SMT Package
Product Description
The AH210 is a high gain, high dynamic range driver
amplifier in a low-cost surface mount package. The
InGaP/GaAs HBT is able to achieve superior
performance over a broad frequency range with a gain of
25dB, +49 dBm OIP3 and +30 dBm of compressed 1-dB
power. The part is housed in an industry standard SOIC-8
SMT package. All devices are 100% RF and dc tested.

The product is targeted for use as driver amplifier for
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, W-CDMA, and UMTS,
where high gain, high linearity and high power are
required. The internal active bias allows the AH210 to
maintain high performance over temperature and the
active bias circuitry allows it to operate directly off a +5
V supply.
Functional Diagram











Function Pin
No.
V
c1
1
Vbias 2
Input
3
Bias Control
4
Output / V
c2
5,6,7,8
GND Slug
Target Specifications
Parameters
Units Min
Typ
Max
Frequency
Range
MHz 1500 1960 2300
S21 - Gain
dB
25
S11 - Input R.L.
dB
-15
S22 - Output R.L.
dB
-15
Output
P1dB
dBm +30
Output IP3
2
dBm +47
Noise Figure
dB
5.0
IS-95 Channel Power
@ -55 dBc ACPR, 9 Ch .Fwd., 1960 MHz
dBm +21.5
IS-95 Channel Power
@ -65 dBc ACPR, 9 Ch .Fwd., 1960 MHz
dBm +19
W-CDMA Channel Power
@ -50 dBc, 2140MHz, 64 DPCH
dBm +20
W-CDMA Channel Power
@ -55 dBc, 2140MHz, 64 DPCH
dBm +19
Operating Current Range
mA
440
Device
Voltage
V 5

Test conditions unless otherwise noted.
1. T = 25C, Vsupply = +5 V, Frequency = 1960 MHz, in recommended application circuit.
2. 3OIP measured with two tones at an output power of +15 dBm/tone separated by 1 MHz.
The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Typical Specifications
Parameters Units
Typical
Frequency
MHz
1850
1960
2140
S21 - Gain
dB
26
25
24
S11 - Input R.L.
dB
-14
-15
-16
S22 - Output
R.L.
dB -14 -15 -17
Output P1dB
dBm
30
+30
+29.5
Output IP3
2
dBm
47
+47
+49
Noise Figure
dB
5.0
5.0
5.0
Supply Bias
+5 V @ 440 mA

Typical parameters reflect performance in an application circuit:
Absolute Maximum Rating
Ordering Information
Parameters
Rating
Part No.
Description
RF Input Power (continuous)
+10 dBm
AH210
1 Watt, High Linearity HBT Amplifier
dc Voltage
+6 V
(Available in Tape & Reel)
Operation of this device above any of these parameters may cause permanent damage.

Thermal Information
Parameters
Rating
Operating Case Temperature
-40 to +85
C
Storage Temperature
-55 to +150
C
Thermal Resistance
33
C/W
. To ensure MTTF > 1x10e6 hrs




4
2
3
1
5
Bias
Active
7
6
8
This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
April 2003
The Communications Edge
TM
AH210
1 Watt, High Gain HBT Amplifier
Preliminary Product Information
Outline Drawing

Land Pattern
Product Marking
The component will be marked with an "AH210"
designator with a four- or five-digit alphanumeric lot
code on the top surface of the package. Tape and reel
specifications for this part is located on the website in
the "Application Notes" section.

ESD / MSL Information
ESD Classification: Class 1B
Value: Passes
at
1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114

MSL Rating:
Level 2
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135") diameter drill and have a final plated
thru diameter of .25 mm (.010").
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
4. Add mounting screws near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5. For optimal thermal performance, expose soldermask
on backside where it contacts the heatsink.
6. RF trace width depends upon the PC board material
and construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are
in degrees.

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