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Datasheet: AH117 (WJ Communications)

 

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WJ Communications

Document Outline

This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
April
2003
The Communications Edge
TM
AH117
Watt, High Linearity InGaP HBT Amplifier
Preliminary Product Information
Product Features
400 2200 MHz
+24 dBm P1dB
+41 dBm Output IP3
18.5 dB Gain @ 900 MHz
15 dB Gain @ 1900 MHz
Single Positive Supply (+5V)
SOT-89 SMT Package
Product Description
The AH117 is a high gain, high dynamic range driver
amplifier in a low-cost surface mount package. The
InGaP/GaAs HBT is able to achieve performance over a
broad range with +41 dBm OIP3 and +24 dBm of
compressed 1-dB power and is housed in an industry
standard SOT-89 SMT package. All devices are 100%
RF and DC tested.

The product is targeted for use as a gain block/driver
amplifier for various current and next generation wireless
technologies such as GPRS, GSM, CDMA, W-CDMA,
and UMTS, where high linearity and medium power is
required. In addition, the AH117 will work for numerous
other applications within the 440 to 2000 MHz frequency
range such as CATV and fixed wireless. The internal
active bias allows the AH117 to maintain high
performance and low gain variation over temperature.
Functional Diagram

1
3
2
4
Function Pin
No.
Input / Base
1
Output / Collector
3
Ground 2,
4
Specifications
Parameters
Units Min Typ
Max
Frequency Range
MHz
400
1900
2200
Gain dB
15
Input R.L.
dB
14
Output R.L.
dB
8
Output P1dB
dBm
+24
Output IP3
2
dBm
+41
Noise Figure
dB
5.5
IS-95 Channel Power
@ -65 dBc ACPR, 9 Ch .Fwd., 1960MHz
dBm +11
Operating Current Range
mA
120
Device Voltage
V
5

Test conditions unless otherwise noted. Specifications apply across entire frequency band.
1. T = 25C, Vsupply = +5 V, Frequency = 1900 MHz, in recommended application circuit
2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz.
The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.

Typical Performance
Parameters
Units
Typical
Frequency
MHz
900
1900
S21
dB
18.5
15
S11 dB
-13
-14
S22 dB
-11
-8
Output P1dB
dBm
+24
+23
Output IP3
2
dBm
+39
+39
Noise Figure
dB
5.0
5.5
Supply Bias
+5 V @ 120 mA

Typical parameters reflect performance in recommended application circuit:



Absolute Maximum Rating
Ordering Information
Parameters
Rating
Part No.
Description
Operating Case Temperature
-40 to +85
C
AH117
0.25 Watt, High Linearity InGaP HBT Amplifier
Storage Temperature
-55 to +150
C
(Available in Tape & Reel)
RF Input Power (Continuous)
+12 dBm
dc Voltage / Current
+6 V / 200mA
Operation of this device above any of these parameters may cause permanent damage.
This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
April
2003
The Communications Edge
TM
AH117
Watt, High Linearity InGaP HBT Amplifier
Preliminary Product Information
Outline Drawing


Land Pattern
Product Marking
The component will be marked with an "AH117"
designator with a four- or five-digit alphanumeric lot
code on the top surface of the package. Tape and reel
specifications for this part is located on the website in
the "Application Notes" section.
ESD / MSL Information
ESD Classification: Class 1B
Value: Passes
at
1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114

MSL Rating:
Level 2
Standard:
JEDEC Standard J-STD-020A




Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135") diameter drill and have a final plated
thru diameter of .25 mm (.010").
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
April
2003
The Communications Edge
TM
AH117
Watt, High Linearity InGaP HBT Amplifier
Preliminary Product Information
Typical Device Data
S-Parameters (V
D
= +5 V, I
D
= 120 mA, T = 25
C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50 -2.65
177.33
17.51
152.58
-31.50
-0.15 -3.65
-177.48
100 -2.57 168.77 16.57 153.47 -31.42 -6.89 -3.50 171.39
200 -2.59 155.22 16.22 143.38 -31.36 -16.84 -3.49 155.69
300 -2.57 142.28 16.10 130.25 -31.38 -26.35 -3.52 141.70
400 -2.55 129.43 15.88 116.45 -31.34 -35.08 -3.57 128.21
500 -2.54 116.66 15.68 101.74 -31.37 -44.64 -3.63 115.10
600 -2.54 104.00 15.53 87.19 -31.18 -53.64 -3.72 102.05
700 -2.50 91.29 15.32 73.27 -31.23 -62.35 -3.80 89.03
800 -2.46 78.85 15.02 58.60 -31.20 -71.87 -3.90 76.35
900 -2.48 66.07 14.92 44.31 -30.96 -80.68 -3.98 63.64
1000 -2.47 53.51 14.58 31.42 -30.92 -88.65 -4.08 51.08
1100 -2.45 40.86 14.24 16.61 -30.89 -99.45 -4.17 38.62
1200 -2.41 28.14 14.11 3.55 -30.63
-107.77 -4.28 26.05
1300 -2.42 15.33 13.65 -10.11 -30.78
-116.61 -4.37 13.46
1400 -2.43 2.44 13.51 -25.13
-30.47
-128.20
-4.46 1.13
1500 -2.42 -10.30 13.36 -36.95 -30.12 -135.92 -4.57 -11.46
1600 -2.45 -23.37 12.90 -50.59 -30.33 -146.12 -4.67 -23.86
1700 -2.42 -36.30 12.79 -64.30 -29.95 -156.80 -4.76 -36.59
1800 -2.46 -49.39 12.52 -76.30 -29.77 -164.31 -4.85 -48.97
1900 -2.48 -62.48 12.14 -89.28 -29.90 -174.43 -4.97 -61.57
2000 -2.47 -76.10 11.88 -103.20 -29.75 175.27 -5.01 -74.30
2100 -2.50 -89.48 11.61 -116.14 -29.53 165.09 -5.10 -87.08
2200 -2.47 -102.75 11.38 -130.40 -29.40 154.30 -5.12 -99.62
2300 -2.48 -115.96 11.32 -141.99 -29.11 145.05 -5.20 -112.43
2400 -2.49 -129.34 10.77 -154.82 -29.18 134.89 -5.21 -125.02
2500 -2.48 -142.86 10.78 -168.81 -28.67 123.06 -5.22 -137.81
2600 -2.47 -155.90 10.34 -177.90 -28.56 119.33 -5.25 -150.27
2700 -2.47 -169.14 9.60 166.21 -29.51 104.59 -5.25 -162.60
2800 -2.45 178.16 9.77 153.14 -28.46 92.39 -5.23 -174.85
2900 -2.44 165.28 9.23 142.29 -28.79 86.95 -5.26 172.90
3000 -2.43 152.51 9.02 127.63 -28.69 70.65 -5.24 160.87

Thermal Information
Parameters
Rating
Operating Case Temperature
-40 to +85
C
Storage Temperature
-55 to +150
C
Thermal Resistance
125
C/W
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