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Datasheet: V048F120M025 (Vicor Corporation)

V, I Chiptm-vtm Voltage Transformation Module

 

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Vicor Corporation
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 1 of 16
PRELIMINARY
Product Description
The V048K120T025 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP, FPGA,
and ASIC at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 s and delivers up to 25 A in a
volume of less than 0.25 in
3
with unprecedented
efficiency. It may be paralleled to deliver hundreds of
amps at an output voltage settable from 6.5 to 13.7 Vdc.
The VTM V048K120T025's nominal output voltage is
12 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 6.5 to 13.7 Vdc at no load, and from
6.5 to 13.4 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closed-
loop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/4 , for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 12 V VTM achieves break-through power density of
1200 W/in
3
in a VI Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The VI Chip BGA package supports in-board
mounting with a low profile of 0.16" (4 mm) over the
board.
A J-lead package option supports on-board surface
mounting with a profile of only 0.25" (6 mm) over the
board. The VTM's fast dynamic response and low noise
eliminate the need for bulk capacitance at the load,
substantially increasing the POL density while improving
reliability and decreasing cost.
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
VC to -In
-0.3 to 19.0
Vdc
+Out to -Out
-0.1 to 30.0
Vdc
Isolation voltage
2,250
Vdc
Input to Output
Output current
25
A
Continuous
Peak output current
37.5
A
For 1 ms
Output power
300
W
Continuous
Peak output power
450
W
For 1 ms
Case temperature
208
C
During reflow
Operating junction temperature
(1)
-40 to 125
C
T - Grade
-55 to 125
C
M - Grade
Storage temperature
-40 to 150
C
T - Grade
-65 to 150
C
M - Grade
VI Chip
TM
VTM
Voltage Transformation Module
48 V to 12 V VI Chip Converter
25 A (37.5 A for 1 ms)
High density 1200 W/in
3
Small footprint 280 W/in
2
Low weight 0.5 oz (14 g)
Pick & Place / SMD
125C operation
1 s transient response
3.5 million hours MTBF
Typical efficiency 96%
No output filtering required
Surface mount BGA or J-Lead
packages
V048K120T025
Actual size
VTM
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=I
OUT
)
V
048
K
120
T
025
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (C)
Grade
Storage
Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
Configuration Options
F = On-board (Figure 15)
K = In-board (Figure 14)
Output Voltage
Designator
(=V
OUT
x10)
Part Numbering
Vf = 26 - 55 V
V
OUT
= 6.5 - 13.7 V
I
OUT
= 25 A
K = 1/4
R
OUT
= 13.9 m
max
Absolute Maximum Ratings
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 2 of 16
VI Chip Voltage Transformation Module
PRELIMINARY
Electrical Specifications
Parameter
Min
Typ
Max
Unit
Note
Input voltage range
26
48
55
Vdc
Operable down to zero V with VC voltage applied
Input dV/dt
1
V/s
Input overvoltage turn-on
55
Vdc
Input overvoltage turn-off
59
Vdc
Input current
6.8
Adc
Input reflected ripple current
170
mA p-p
Using test circuit in Figure 16; See Figure 1
No load power dissipation
4.7
5.7
W
Internal input capacitance
4
F
Internal input inductance
20
nH
Input Specs
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
Note
Output voltage
9.5
13.7
Vdc
No load
9.2
13.4
Vdc
Full load
Rated DC current
0
25
Adc
Peak repetitive current
37.5
A
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
DC current limit
25.5
30.0
36.3
Adc
Module will shut down when current limit is reached
or exceeded
Current share accuracy
5
10
%
See Parallel Operation on Page 10
Efficiency
Half load
95.0
95.5
%
See Figure 3
Full load
95.0
96.0
%
See Figure 3
Internal output inductance
1.1
nH
Internal output capacitance
55
F
Effective value
Load capacitance
1,000
F
Output overvoltage setpoint
13.8
Vdc
Output ripple voltage
No external bypass
144
214
mV
See Figures 2 and 5
10 F bypass capacitor
12.8
mV
See Figure 6
Effective switching frequency
2.5
2.8
3.2
MHz
Fixed, 1.4 MHz per phase
Line regulation
K
0.2475
1/4 0.2525
V
OUT
= KV
IN
at no load
Load regulation
R
OUT
11.7
13.9
m
See Figure 19
Transient response
Voltage overshoot
355
mV
25 A load step with 100 F C
IN
; See Figures 7 and 8
Response time
200
ns
See Figures 7 and 8
Recovery time
1
s
See Figures 7 and 8
Output Specs
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 3 of 16
PRELIMINARY
Figure 1-- Input reflected ripple current at full load and 48 Vf.
Efficiency vs. Output Current
84
86
88
90
92
94
96
98
0
2.5
5
7.5
10
12.5
15
17.5
20
22.5
25
Output Current (A)
Efficiency (%)
Figure 3-- Efficiency vs. output current at 48 Vf.
Power Dissipation vs. Output Current
0
2
4
6
8
10
12
14
0
2.5
5
7.5
10
12.5
15
17.5
20
22.5
25
Output Current (A)
Power Dissipation (W)
Figure 4--Power dissipation as a function of output current at 48 Vf.
Waveforms
Figure 6--Output voltage ripple at full load and 12 Vout with 10 F
ceramic external bypass capacitance and 20 nH distribution inductance.
Figure 5-- Output voltage ripple at full load and 12 Vout; without any
external bypass capacitor.
Ripple Voltage vs. Output Current
0
20
40
60
80
100
120
140
160
0
2.5
5
7.5
10
12.5
15
17.5
20
22.5
25
Output Current (A)
Output Ripple (mVpk-pk)
Figure 2-- Output voltage ripple vs. output current at 12 Vout with no POL
bypass capacitance.
Electrical Specifications
(continued)
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 4 of 16
VI Chip Voltage Transformation Module
PRELIMINARY
Parameter
Min
Typ
Max
Unit
Note
Primary Control (PC)
DC voltage
4.8
5.0
5.2
Vdc
Module disable voltage
2.4
2.5
Vdc
Module enable voltage
2.5
2.6
Vdc
VC voltage must be applied when module is enabled using PC
Current limit
2.4
2.5
2.9
mA
Source only
Disable delay time
4
10
s
PC low to Vout low
VTM Control (VC)
External boost voltage
12.0
14.0
19.0
Vdc
Required for VTM start up without PRM
External boost duration
10
ms
Vin > 26 Vdc. VC must be applied continuously
if Vin < 26 Vdc.
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
3.5
Mhrs
25C, GB
Isolation specifications
Voltage
2,250
Vdc
Input to Output
Capacitance
3,000
pF
Input to Output
Resistance
10
M
Input to Output
Agency approvals (pending)
cTVus
UL/CSA 60950, EN 60950
CE Mark
Low voltage directive
Mechanical parameters
See Mechanical Drawing, Figures 10 and 12
Weight
0.5 / 14.0
oz / g
Dimensions(BGA version)
Length
1.26 / 32
in / mm
Width
0.85 / 21.5
in / mm
Height
0.23 / 5.9
in / mm
General
Figure 7-- 0-25 A step load change with 100 F input capacitance and no
output capacitance.
Figure 8-- 25-0 A step load change with 100 F input capacitance and no
output capacitance.
Electrical Specifications
(continued)
vicorpower.com
800-735-6200
VI Chip Voltage Transformation Module
V048K120T025
Rev. 1.0
Page 5 of 16
PRELIMINARY
VI Chip Stress Driven Product Qualification Process
Symbol
Parameter
Min
Typ
Max
Unit
Note
Over temperature shutdown
125
130
135
C
Junction temperature
Thermal capacity
0.61
Ws/C
R
JC
Junction-to-case thermal impedance
1.1
C/W
R
JB
Junction-to-BGA thermal impedance
2.1
C/W
R
JA
Junction-to-ambient
(1)
6.5
C/W
R
JA
Junction-to-ambient
(2)
5.0
C/W
Thermal
Notes:
(1) V048K120T025 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) V048K120T025 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
Test
Standard
Environment
High Temperature Operational Life (HTOL)
JESD22-A-108-B
125C, Vmax, 1,008 hrs
Temperature cycling
JESD22-A-104B
-55C to 125C, 1,000 cycles
High temperature storage
JESD22-A-103A
150C, 1,000 hrs
Moisture resistance
JESD22-A113-B
Moisture sensitivity Level 5
Temperature Humidity Bias Testing (THB)
EIA/JESD22-A-101-B
85C, 85% RH, Vmax, 1,008 hrs
Pressure cooker testing (Autoclave)
JESD22-A-102-C
121C, 100% RH, 15 PSIG, 96 hrs
Highly Accelerated Stress Testing (HAST)
JESD22-A-110B
130C, 85% RH, Vmax, 96 hrs
Solvent resistance/marking permanency
JESD22-B-107-A
Solvents A, B & C as defined
Mechanical vibration
JESD22-B-103-A
20g peak, 20-2,000 Hz, test in X, Y & Z directions
Mechanical shock
JESD22-B-104-A
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Electro static discharge testing human body model
EIA/JESD22-A114-A
Meets or exceeds 2,000 Volts
Electro static discharge testing machine model
EIA/JESD22-A115-A
Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Per Vicor Internal
Operation limits verified, destruct margin determined
Test Specification
(1)
Dynamic cycling
Per Vicor internal
Constant line, 0-100% load, -20C to 125C
test specification
(1)
Note:
(1) For details of the test protocols see Vicor's website.
Test
Standard
Environment
BGA solder fatigue evaluation
IPC-9701
Cycle condition: TC3 (-40 to +125C)
IPC-SM-785
Test duration: NTC-B (500 failure free cycles)
Solder ball shear test
IPC-9701
Failure through bulk solder or copper pad lift-off
VI Chip Ball Grid Array Interconnect Qualification
Electrical Specifications
(continued)
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