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Datasheet: V048F015T80 (Vicor Corporation)

Vi Chip - Vtm Voltage Transformation Module

 

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Vicor Corporation
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 1 of 20
4
5
4
5
PRELIMIN
ARY
Product Description
The V048K015T80 V
I Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 s and delivers up to 80A in a
volume of less than 0.25 in
3
while converting 48 V to
1.5 V with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 1.0 to 1.8 Vdc.
The VTM V048K015T80's nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, V
f
, and is
controllable from 1.0 to 1.8 Vdc at no load, and from
0.9 V to 1.7 V at full load, over a V
f
input range of 32 to
57.6 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its V
f
input voltage with a transformation ratio,
K=
1
/
32
, and an output resistance, R
OUT
=1.3 milliohm,
to enable applications requiring a programmable low
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter may be used to
compensate for R
OUT
.
The 1.5V VTM achieves break-through current density
of 320 A/in
3
in a V
I Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The V
I Chip BGA package supports in-board
mounting with a low profile of 0.16" (4mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6mm)
over the board. The VTM's fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
Absolute Maximum Ratings
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
TM to -In
-0.3 to 7.0
Vdc
SG to -In
500
mA
+Out to -Out
-0.5 to 5.0
Vdc
Isolation voltage
1500
Vdc
Input to Output
Operating junction temperature
-40 to 125
C
See note 2
Output current
80
A
Continuous
Peak output current
120
A
For 1 ms
Case temperature during reflow
208
C
Storage temperature
-40 to 150
C
Output power
144
W
Continuous
Peak output power
216
W
For 1 ms
Thermal Resistance
Symbol
Parameter
Typ
Max
Units
R
JC
Junction-to-case
1.1
1.5
C/W
R
JB
Junction-to-BGA
2.1
2.5
C/W
R
JA
Junction-to-ambient
3
6.5
7.2
C/W
R
JA
Junction-to-ambient
4
5.0
5.5
C/W
VI Chip
TM
VTM
Voltage Transformation Module
48V to 1.5V VI Chip Converter
80 A (120 A for 1 ms)
High density up to 320 A/in
3
Small footprint 80 A/in
2
Low weight 0.4 oz (12 g)
Pick & Place / SMD
>92% efficiency at 1.5V
125C operation
1 s transient response
>3.5 million hours MTBF
No output filtering required
VI Chip BGA package
V048K015T80
1
V
f
= 32 - 57.6 V
V
OUT
= 1.0 - 1.8 V
I
OUT
= 80 A
K =
1
/
32
R
OUT
= 1.5 m
max
Notes
1. For complete product matrix, see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Actual size
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 2 of 20
4
5
PRELIMIN
ARY
Specifications
Parameter
Min
Typ
Max
Unit
Note
Input voltage range
32
48
57.6
V
Input dV/dt
10
V/s
Input undervoltage turn-on
32
V
Input undervoltage turn-off
29.5
V
Input overvoltage turn-on
57.6
V
Input overvoltage turn-off
59.0
V
Input quiescent current
2.0
2.4
mA
PC low
Inrush current overshoot
0.7
A
Using test circuit in Fig.24; See Fig.1
Input current
2.7
A
Input reflected ripple current
28
mA p-p
Using test circuit in Fig.24; See Fig.4
No load power dissipation
2.5
3.5
W
Internal input capacitance
1
F
Internal input inductance
20
nH
Recommended external input capacitance
8
100
F
200 nH maximum source inductance; See Fig.24
INPUT (Conditions are at nominal line, full load, and 25C ambient unless otherwise specified)
Figure 1-- Inrush transient current at no load and nominal V
IN
with PC enabled
Figure 2-- Output voltage turn-on waveform with PC enabled
at full load and nominal V
IN
Figure 3--Output voltage turn-on waveform with input turn-on
at full load and nominal V
IN
Figure 4-- Input reflected ripple current at full load and
nominal V
IN
INPUT WAVEFORMS
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 3 of 20
4
5
PRELIMIN
ARY
Specifications, continued
Parameter
Min
Typ
Max
Unit
Note
Rated DC current
0
80
A
Peak repetitive current
120
A
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
DC current limit
80
95
120
A
Current share accuracy
5
10
%
See Parallel Operation on page 11
Efficiency
Half load
93.0
93.8
%
See Fig.5
Full load
90.8
91.7
%
See Fig.5
Internal output inductance
1.6
nH
Internal output capacitance
300
F
Effective value
Load capacitance
100,000
F
Output overvoltage setpoint
1.83
V
Output ripple voltage
No external bypass
47
70
mV
See Figs.7 and 10
200F bypass capacitor
2
mV
See Fig.8
Average short circuit current
200
mA
Effective switching frequency
2.5
3.0
3.6
MHz
Fixed, 1.5 MHz per phase
Line regulation
K
0.0309
1/32
0.0316
V
OUT
=KV
IN
at no load
Load regulation
R
OUT
1.3
1.5
m
See Figs.9 and 27
Transient response
Voltage undershoot
10
mV
0-80A load step with 100F C
IN;
See Figs.11 and 12
Voltage overshoot
26
mV
80-0A load step with 100F C
IN
Response time
200
ns
See Figs.11 and 12
Recovery time
1
s
See Figs.11 and 12
Output overshoot
Input turn-on
0
mV
PC enable
0
mV
Output turn-on delay
From application of power
170
250
ms
No output filter; See Fig.3
From release of PC pin
300
s
No output filter; See Fig.2
OUTPUT (Conditions are at nominal line, full load, and 25C ambient unless otherwise specified)
Efficiency vs. Output Current
Output Current (A)
Eficiency (%)
85
86
87
88
89
90
91
92
93
94
95
8
16
24
32
40
48
56
64
72
80
Figure 5-- Efficiency vs. output current at 1.5V V
OUT
Power Dissipation vs. Output Current
Output Current (A)
Power Dissipation (W)
0
2
4
6
8
10
12
8
16
24
32
40
48
56
64
72
80
Figure 6--Power dissipation as a function of output current at
1.5V V
OUT
OUTPUT WAVEFORMS
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 4 of 20
4
5
PRELIMINARY
Specifications, continued
Figure 8--Output voltage ripple at full load and nominal V
IN
with 200 F ceramic external bypass capacitance.
Figure 7-- Output voltage ripple at full load and nominal V
IN
;
without any external bypass capacitor.
Figure 9-- Output impedance vs. frequency
Output Current (A)
Output Ripple (mV)
0
5
10
15
20
25
30
35
40
45
50
8
16
24
32
40
48
56
64
72
80
Output Ripple vs. Load
Figure 10-- Output voltage ripple vs. output current at nominal
line with no POL bypass capacitance.
Figure 11-- 0-80A step load change with 100 F input
capacitance and no output capacitance.
Figure 12-- 0-80A step load change with 100 F input
capacitance and 100 F output capacitance.
TBD
Vicor Corporation Tel: 800-735-6200 vicorpower.com
VI Chip Voltage Transformation Module
Rev. 1.6
Page 5 of 20
4
5
PRELIMIN
ARY
Parameter
Min
Typ
Max
Unit
Note
Primary Control (PC)
DC voltage
4.8
5.0
5.2
V
Module disable voltage
2.4
2.5
V
Module enable voltage
2.5
2.6
V
Current limit
2.4
2.5
2.9
mA
Source only
Enable delay time
300
450
s
See Fig.2
Disable delay time
4
10
s
Temperature Monitor (TM)
27C setting
2.95
3.00
3.05
V
Operating junction temperature
Temperature coefficient
10
mV/C
Full range accuracy
-5
5
C
Operating junction temperature
Current limit
100
A
Source only
Auxiliary Pins (Conditions are at nominal line, full load, and 25C ambient unless otherwise specified)
Figure 13-- V
OUT
at full load vs. PC disable
Figure 14-- PC signal during fault
Specifications, continued
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
3.6
Mhrs
25C, GB
Telcordia TR-NT-000332
4.2
Mhrs
Telcordia SR-332
TBD
hrs
Demonstrated
TBD
hrs
Isolation specifications
Voltage
1,500
Vdc
Input to Output
Capacitance
5,100
6,000
pF
Input to Output
Resistance
10
M
Input to Output
Agency approvals (pending)
cTVus
UL/CSA 60950, EN 60950
CE Mark
Low voltage directive
Mechanical parameters
See mechanical drawing, Figs.16 and 18
Weight
0.43 / 12.25
oz / g
Dimensions
Length
1.26 / 32
in / mm
Width
0.85 / 21.5
in / mm
Height
0.24 / 6
in / mm
GENERAL
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