HTML datasheet архив (поиск документации на электронные компоненты) Поиск даташита (1.687.043 компонентов)
Где искать

Datasheet: B048K096M24 (Vicor Corporation)

VI ChipTM - BCM Bus Converter Module

 

Скачать: PDF   ZIP
Vicor Corporation
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B048K096T24
Rev. 3.0
Page 1 of 15
VI Chip Bus Converter Module
PRELIMINARY
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 60.0
Vdc
+In to -In
100
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 16.0
Vdc
Isolation voltage
2,250
Vdc
Input to Output
Output current
31.5
A
Continuous
Peak output current
37.5
A
For 1 ms
Output power
240
W
Continuous
Peak output power
360
W
For 1 ms
Case temperature
208
C
During reflow
Operating junction temperature
(1)
-40 to 125
C
T - Grade
-55 to 125
C
M - Grade
Storage temperature
-40 to 150
C
T - Grade
-65 to 150
C
M - Grade
48 V to 9.6 V VI Chip Converter
240 Watt (360 Watt for 1 ms)
High density 974 W/in
3
Small footprint 220 W/in
2
Low weight 0.5 oz (14 g)
ZVS/ZCS isolated sine
amplitude converter
Typical efficiency 96%
125C operation
<1 s transient response
3.5 million hours MTBF
No output filtering required
Surface mount BGA or J-Lead
packages
B048K096T24
Vin = 38 - 55 V
Vout = 7.60 - 11.0 V
Iout = 25.0 A
K = 1/5
Rout = 10.0 m max
Actual size
VI Chip
TM
BCM
Bus Converter Module
BCM
Output Power
Designator
(=P
OUT
/10)
B
048
K
096
T
24
Bus Converter
Module
Input Voltage
Designator
Product Grade Temperatures (C)
Grade
Storage
Operating
T
-40 to150 -40 to125
M
-65 to150 -55 to125
Configuration Options
F = Onboard (Figure 20)
K = Inboard (Figure 19)
Output Voltage
Designator
(=V
OUT
x10)
Part Numbering
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Product Description
The VI Chip Bus Converter Module (BCM) is a high
efficiency (>96%), narrow input range Sine Amplitude
Converter (SAC) operating from a 38 to 55 Vdc primary
bus to deliver an isolated 7.60 V to 11.0 V secondary.
The BCM may be used to power non-isolated POL
converters or as an independent 7.60 11.0 V source.
Due to the fast response time and low noise of the
BCM, the need for limited life aluminum electrolytic or
tantalum capacitors at the input of POL converters is
reduced--or eliminated--resulting in savings of board
area, materials and total system cost.
The BCM achieves a power density of 974 W/in
3
and
may be surface mounted with a profile as low as 0.16"
(4 mm) over the PCB. Its VI Chip power package is
compatible with onboard or inboard surface mounting.
The VI Chip package provides flexible thermal
management through its low Junction-to-Case and
Junction-to-BGA thermal resistance. Owing to its high
conversion efficiency and safe operating temperature
range, the BCM does not require a discrete heat sink in
typical applications. It is also available with heat sink
options, assuring low junction temperatures and long
life in the harshest environments.
Absolute Maximum Ratings
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B048K096T24
Rev. 3.0
Page 2 of 15
VI Chip Bus Converter Module
PRELIMINARY
Specifications
Parameter
Min
Typ
Max
Unit
Note
Input voltage range
38
48
55
Vdc
Input dV/dt
1
V/s
Input undervoltage turn-on
38.0
Vdc
Input undervoltage turn-off
32.0
Vdc
Input overvoltage turn-on
55.0
Vdc
Input overvoltage turn-off
59.5
Vdc
Input quiescent current
2.54
mA
PC low
Inrush current overshoot
5.3
A
Using test circuit in Figure 21; See Figure 1
Input current
5.4
Adc
Input reflected ripple current
140
mA p-p
Using test circuit in Figure 21; See Figure 4
No load power dissipation
3.1
4.1
W
Internal input capacitance
4.0
F
Internal input inductance
20
nH
Recommended external input capacitance
47
F
200 nH maximum source inductance; See Figure 21
Input
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Figure 1-- Inrush transient current at full load and 48 Vin with PC enabled
Figure 2-- Output voltage turn-on waveform with PC enabled at full load
and 48 Vin
Figure 3--Output voltage turn-on waveform with input turn-on at full load
and 48 Vin
Figure 4-- Input reflected ripple current at full load and 48 Vin
Input Waveforms
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B048K096T24
Rev. 3.0
Page 3 of 15
VI Chip Bus Converter Module
PRELIMINARY
Parameter
Min
Typ
Max
Unit
Note
Output voltage
7.60
11.0
Vdc
No load
7.35
10.8
Vdc
Full load
Output power
0
240
W
40 - 55 V
IN
0
229
W
38 - 55 V
IN
Rated DC current
0
31.5
Adc
P
OUT
240 W
Peak repetitive power
360
W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
Current share accuracy
5
10
%
See Parallel Operation on Page 12
Efficiency
Half load
95.5
96.2
%
See Figure 5
Full load
95.5
96.2
%
See Figure 5
Internal output inductance
1.6
nH
Internal output capacitance
55.0
F
Effective value
Load capacitance
1,600
F
Output overvoltage setpoint
11.0
Vdc
Module will shut down
Output ripple voltage
No external bypass
176
200
mV
See Figures 7 and 9
10 F bypass capacitor
17.4
mV
See Figure 8
Short circuit protection set point
33.3
38.7
45.0
Adc
Module will shut down
Average short circuit current
0.43
A
Effective switching frequency
3.0
3.1
3.4
MHz
Fixed, 1.6 MHz per phase
Line regulation
K
0.1980
1/5 0.2020
V
OUT
= KV
IN
at no load
Load regulation
R
OUT
8.9
10.0
m
Transient response
Voltage overshoot
90
mV
100% load step; See Figures 10 and 11
Response time
200
ns
See Figures 10 and 11
Recovery time
1
s
See Figures 10 and 11
Output overshoot
Input turn-on
0
mV
No output filter; See Fig.3
PC enable
0
mV
No output filter; See Fig.2
Output turn-on delay
From application of power
288
ms
No output filter; See Fig.3
From release of PC pin
70
ms
No output filter
Output
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Efficiency vs. Output Power
87
88
89
90
91
92
93
94
95
96
97
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Efficiency (%)
Figure 5-- Efficiency vs. output power at 48 Vin
Power Dissipation
0
1
2
3
4
5
6
7
8
9
10
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Power Dissipation (W)
Figure 6--Power dissipation as a function of output power
Output Waveforms
Specifications
(continued)
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B048K096T24
Rev. 3.0
Page 4 of 15
VI Chip Bus Converter Module
PRELIMINARY
Figure 8--Output voltage ripple at full load and 48 Vin with 10 F ceramic
external bypass capacitor and 20 nH of distribution inductance.
Figure 7-- Output voltage ripple at full load and 48 Vin; without any
external bypass capacitor.
Ripple vs. Output Power
0
20
40
60
80
100
120
140
160
180
0
20
40
60
80 100 120 140 160 180 200 220 240
Output Power (W)
Output Ripple (mVpk-pk)
Figure 9-- Output voltage ripple vs. output power at 48 Vin line without
any external bypass capacitor.
Figure 10-- 0 -25.0 A load step with 47 F input capacitor and no
output capacitor.
Figure 11-- 25.0- 0 A load step with 47 F input capacitance.
Specifications
(continued)
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B048K096T24
Rev. 3.0
Page 5 of 15
VI Chip Bus Converter Module
PRELIMINARY
Parameter
Min
Typ
Max
Unit
Note
Primary control (PC)
DC voltage
4.8
5.0
5.2
Vdc
Module disable voltage
2.4
2.5
Vdc
Module enable voltage
2.5
2.6
Vdc
Current limit
2.4
2.5
2.9
mA
Source only
Enable delay time
70
ms
Disable delay time
10
s
See Fig.12 time from PC low to output low
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Figure 12-- V
OUT
at full load vs. PC disable
Figure 13-- PC signal during fault
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
3.5
Mhrs
25C, GB
Isolation specifications
Voltage
2,250
Vdc
Input to Output
Capacitance
3,000
pF
Input to Output
Resistance
10
M
Input to Output
Agency approvals (pending)
cTVus
UL/CSA 60950, EN 60950
CE Mark
Low voltage directive
Mechanical parameters
See Mechanical Drawing, Figures 15 and 17
Weight
0.50 / 14
oz / g
Dimensions
Length
1.26 / 32
in / mm
Width
0.85 / 21.5
in / mm
Height
0.23 / 6
in / mm
General
Specifications
(continued)
© 2017 • ChipFind
Контакты
Главная страница