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 STATS ChipPAC, Ltd. datasheets

Компоненты: 15, страницы: 1 (0.29 сек.)  
STATS ChipPAC, Ltd.
STATS ChipPAC, Ltd.
www.statschippac.com
  1. BCC - Bump Chip Carrier
  2. FBGA - Fine Pitch Ball Grid Array
  3. FBGA-SD - Fine Pitch Ball Grid Array - Stacked Die
  4. FLGA - Fine Pitch Land Grid Array
  5. FLGA-SD - Fine Pitch Land Grid Array - Stacked Die
  6. LFBGA-H - Fine Pitch Ball Grid Array
  7. LQFP - Low Profile Quad Flat Pack
  8. MQFP - Metric Quad Flat Pack
  9. MQFP-D - Heat Spreader Metric Quad Flat Pack
  10. MQFP-ED - Exposed Drop-in Heat Slug Metric Quad Flat Pack
  11. MSOP - Small Outline Packages
  12. MSOP-EP - Small Outline Packages
  13. TQFP - Thin Profile Quad Flat Pack
  14. TSSOP - Small Outline Packages
  15. TSSOP-EP - Small Outline Packages
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