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Datasheet: 32TSOP (Maxim Integrated Products)

Package Reliability Report

 

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Maxim Integrated Products
10/29/2004
PACKAGE RELIABILITY REPORT
FOR
32 TSOP 8mm
Dallas Semiconductor
4401 South Beltwood Parkway
Dallas, TX 75244-3292
Prepared by:
Ken Wendel
Reliability Engineering Manager
Dallas Semiconductor
4401 South Beltwood Pkwy.
Dallas, TX 75244-3292
Email : ken.wendel@dalsemi.com
ph: 972-371-3726
fax: 972-371-6016
mbl: 214-435-6610
Conclusion:
32 TSOP 8mm
The following qualification successfully meets the quality and reliability standards required of all Dallas
Semiconductor packages:
Package Description:
A description of this assembly can be found in the product data sheet. You can find the product data
sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.
Reliability Derating:
The Arrhenius model will be used to determine the acceleration factor for failure mechanisms that
are temperature accelerated.
AfT = exp((Ea/k)*(1/Tu - 1/Ts)) = tu/ts
AfT = Acceleration factor due to Temperature
tu = Time at use temperature (e.g. 55C)
ts = Time at stress temperature (e.g. 125C)
k = Boltzmann's Constant (8.617 x 10-5 eV/K)
Tu = Temperature at Use (K)
Ts = Temperature at Stress (K)
Ea = Activation Energy (e.g. 0.7 ev)
The activation energy of the failure mechanism is derived from either internal studies or industry
accepted standards, or activation energy of 0.7ev will be used whenever actual failure mechanisms
or their activation energies are unknown. All deratings will be done from the stress ambient
temperature to the use ambient temperature.
An exponential model will be used to determine the acceleration factor for failure mechanisms,
which are voltage accelerated.
AfV = exp(B*(Vs - Vu))
AfV = Acceleration factor due to Voltage
Vs = Stress Voltage (e.g. 7.0 volts)
Vu = Maximum Operating Voltage (e.g. 5.5 volts)
B = Constant related to failure mechanism type (e.g. 1.0, 2.4, 2.7, etc.)
The Constant, B, related to the failure mechanism is derived from either internal studies or industry
accepted standards, or a B of 1.0 will be used whenever actual failure mechanisms or their B are
unknown. All deratings will be done from the stress voltage to the maximum operating voltage.
Failure rate data from the operating life test is reported using a Chi-Squared statistical model at the
60% or 90% confidence level (Cf).
In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing
assemblies will continue to meet Maxim's quality and reliability standards. The current status of the
reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.
The failure rate, Fr, is related to the acceleration during life test by:
Fr = X/(ts * AfV * AfT * N * 2)
X = Chi-Sq statistical upper limit
N = Life test sample size
The calculated failure rate for this device/process is:
The parameters used to calculate this failure rate are as follows:
Cf: 60%
Ea: 0.7
B: 0
Tu: 25
Vu: 5.5
C
Volts
The reliability data follows. Some of the data in this report may be generic. A the start of this data is
a description of the assembly vehicle used to generate this reliability data. The next section is the
detailed reliability data for each stress. If there are additional assemblies used as part of this report,
a description of each will follow which includes the respective reliability data for that assembly.
Where appropriate, preconditioning is performed before all stresses and the bond crater test unless
otherwise noted. The reliability data section includes the latest data available.
Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate
is related to MTTF by:
MTTF = 1/Fr
NOTE: MTTF is frequently used interchangeably with MTBF.
FITS: 3.0
MTTF (YRS): 37651
FAILURE RATE:
Assembly Site:
ASE
Body Size:
8x13.4x0.965
Pin Count:
28
Package Type:
TSOP
Lead Frame:
Stamped Alloy 42
Assembly Information:
Lead Finsh:
Sn Plate 100% Matte
Mold Compound:
Sumitomo G700
Die Attach:
Sumitomo 1076 DS
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
0429
0429
to
Date Code Range:
Theta JA:
Theta JC:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
JESD22-B102
15
0
SOLDERABILITY
0429
0
Total:
Assembly Site:
ATK (Amkor, K)
Body Size:
8x13.4x0.965
Pin Count:
28
Package Type:
TSOP
Lead Frame:
Stamped Copper C7025
Assembly Information:
Lead Finsh:
SnPb Plate
Mold Compound:
Sumitomo 7351T
Die Attach:
8361J Epoxy Silverfilled Ablebond
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
0303
0223
to
Date Code Range:
Theta JA:
Theta JC:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
125C, 7.0 VOLTS
80
0
HIGH VOLTAGE LIFE
HRS
0223
1000
125C, 7.0 VOLTS
160
0
HIGH VOLTAGE LIFE
HRS
0223
1000
125C, 6.0 VOLTS
77
0
HIGH VOLTAGE LIFE
HRS
0303
0
Total:
Assembly Site:
ATK (Amkor, K)
Body Size:
8x20x1.0
Pin Count:
32
Package Type:
TSOP
Lead Frame:
Stamped Copper C7025
Assembly Information:
Lead Finsh:
SnPb Plate
Mold Compound:
Sumitomo 7351T
Die Attach:
8361J Epoxy Silverfilled Ablebond
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
0303
0038
to
Date Code Range:
Theta JA:
Theta JC:
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
J-STD-020
8
0
ULTRASOUND
0038
24
125C
8
STORAGE LIFE
HRS
240
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
MIL-STD-883-2009
8
0
EXTERNAL VISUAL
J-STD-020
8
0
PRECONDITION U/S
0
Total:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
125C, 6.0 VOLTS
116
0
HIGH VOLTAGE LIFE
HRS
0038
1000
125C, 6.0 VOLTS
77
0
HIGH VOLTAGE LIFE
HRS
0303
0
Total:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
MIL-STD-883-2003
3
0
SOLDERABILITY
0038
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
0038
MIL-STD-883-2016
6
0
PHYSICAL DIMENSIONS
MIL-STD-883-2015
6
0
MARK PERMANENCY
MIL-STD-883-2004 : COND B2
6
0
LEAD INTEGRITY
0
Total:
PRECONDITIONING LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
24
125C
315
STORAGE LIFE
HRS
0038
240
30C/60% R.H.
315
MOISTURE SOAK
HRS
3
235C +5/-0C
315
0
CONVECTION REFLOW
PASS
0
Total:
TEMPERATURE CYCLE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
-55C TO 125C
77
0
TEMP CYCLE
CYS
0038
0
Total:
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
77
0
HAST
HRS
0038
0
Total:
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
200
130C, 85% R.H.
45
0
HAST, NO BIAS
HRS
0038
0
Total:
Assembly Site:
ATP (Amkor, PI)
Body Size:
8x13.4x0.965
Pin Count:
28
Package Type:
TSOP
Lead Frame:
Stamped Copper C7025
Assembly Information:
Lead Finsh:
SnPb Plate
Mold Compound:
Sumitomo 7351T
Die Attach:
8361J Epoxy Silverfilled Ablebond
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
9924
9921
to
Date Code Range:
Theta JA:
Theta JC:
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
J-STD-020
6
0
PRECONDITION U/S
9921
MIL-STD-883-2009
8
0
EXTERNAL VISUAL
J-STD-020
8
0
ULTRASOUND
24
125C
8
STORAGE LIFE
HRS
240
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
J-STD-020
8
0
PRECONDITION U/S
9921
J-STD-020
8
0
ULTRASOUND
24
125C
8
STORAGE LIFE
HRS
240
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
MIL-STD-883-2009
8
0
EXTERNAL VISUAL
0
Total:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
125C, 7.0 VOLTS
116
0
HIGH VOLTAGE LIFE
HRS
9921
1000
125C, 7.0 VOLTS
116
1
HIGH VOLTAGE LIFE
HRS
9924
990165
1
Total:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
SENT TO OUTSIDE SOURCE
5
0
CONSTRUCTION
ANALYSIS
9921
MIL-STD-883-2003
3
0
SOLDERABILITY
9921
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
9921
MIL-STD-883-2016
6
0
PHYSICAL DIMENSIONS
MIL-STD-883-2015
6
0
MARK PERMANENCY
MIL-STD-883-2004 : COND B2
6
0
LEAD INTEGRITY
MIL-STD-883-2003
3
0
SOLDERABILITY
9921
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
9921
MIL-STD-883-2016
6
0
PHYSICAL DIMENSIONS
MIL-STD-883-2015
6
0
MARK PERMANENCY
MIL-STD-883-2004 : COND B2
6
0
LEAD INTEGRITY
0
Total:
PRECONDITIONING LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
24
125C
356
STORAGE LIFE
HRS
9921
240
30C/60% R.H.
356
MOISTURE SOAK
HRS
3
235C +5/-0C
356
0
CONVECTION REFLOW
PASS
0
Total:
TEMPERATURE CYCLE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
-55C TO 125C
77
0
TEMP CYCLE
CYS
9921
1000
-55C TO 125C
91
0
TEMP CYCLE
CYS
9921
0
Total:
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
45
1
HAST
HRS
9921
No FA
100
130C, 85%R.H.,5.5V
90
0
HAST
HRS
9921
1
Total:
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
200
130C, 85% R.H.
45
0
HAST, NO BIAS
HRS
9921
200
130C, 85% R.H.
55
0
HAST, NO BIAS
HRS
9921
0
Total:
Assembly Site:
ATP (Amkor, PI)
Body Size:
8x20x1.0
Pin Count:
32
Package Type:
TSOP
Lead Frame:
Stamped Copper C7025
Assembly Information:
Lead Finsh:
SnPb Plate
Mold Compound:
Sumitomo 7351T
Die Attach:
8361J Epoxy Silverfilled Ablebond
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
0106
9913
to
Date Code Range:
Theta JA:
Theta JC:
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
J-STD-020
8
0
PRECONDITION U/S
9913
J-STD-020
8
0
ULTRASOUND
125C
8
STORAGE LIFE
HRS
240
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
MIL-STD-883-2009
8
0
EXTERNAL VISUAL
0
Total:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
125C, 6.0 VOLTS
85
0
HIGH VOLTAGE LIFE
HRS
9913
1000
125C, 6.0 VOLTS
256
2
HIGH VOLTAGE LIFE
HRS
0106
iBATT
LEAK
2
Total:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
MIL-STD-883-2003
3
0
SOLDERABILITY
9913
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
9913
MIL-STD-883-2016
6
0
PHYSICAL DIMENSIONS 9913
MIL-STD-883-2015
6
0
MARK PERMANENCY
MIL-STD-883-2004 : COND B2
6
0
LEAD INTEGRITY
0
Total:
PRECONDITIONING LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
24
125C
315
STORAGE LIFE
HRS
9913
240
30C/60% R.H.
315
MOISTURE SOAK
HRS
3
235C +5/-0C
315
0
CONVECTION REFLOW
PASS
0
Total:
TEMPERATURE CYCLE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
-55C TO 125C
70
0
TEMP CYCLE
CYS
9913
0
Total:
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
70
0
HAST
HRS
9913
0
Total:
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
200
130C, 85% R.H.
40
0
HAST, NO BIAS
HRS
9913
0
Total:
Assembly Site:
NSEB
Body Size:
8x13.4x0.965
Pin Count:
28
Package Type:
TSOP
Lead Frame:
Stamped Copper C7025
Assembly Information:
Lead Finsh:
SnPb Plate
Mold Compound:
Ciba-Geigy Aratonic 2184-4 (KMC 184)
Die Attach:
84-1 LMISR4 Epoxy Silverfilled Ablebond
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
0432
0432
to
Date Code Range:
Theta JA:
Theta JC:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
JESD22-B102
8
0
SOLDERABILITY
0432
0
Total:
Assembly Site:
NSEB
Body Size:
8x20x1.0
Pin Count:
32
Package Type:
TSOP
Lead Frame:
Stamped Copper C7025
Assembly Information:
Lead Finsh:
SnPb Plate
Mold Compound:
Ciba-Geigy Aratonic 2184-4 (KMC 184)
Die Attach:
84-1 LMISR4 Epoxy Silverfilled Ablebond
Bond Wire / Size:
Au / 1.0 mil
Moisture Sensitivity
(JEDEC J-STD20A)
Level 3
Flammability:
UL 94-V0
0324
0145
to
Date Code Range:
Theta JA:
Theta JC:
CONSTRUCTION ANALYSIS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
TO BE SUBMITTED BY ASSEMBLY SITE
3
0
CONSTRUCTION
ANALYSIS
0146
0
Total:
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
J-STD-020
8
0
ULTRASOUND
0145
24
125C
8
STORAGE LIFE
HRS
192
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
J-STD-020, 6.1a
8
0
EXTERNAL VISUAL
J-STD-020
8
0
PRECONDITION U/S
J-STD-020
8
0
ULTRASOUND
0146
24
125C
8
STORAGE LIFE
HRS
192
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
J-STD-020, 6.1a
8
0
EXTERNAL VISUAL
J-STD-020
8
0
PRECONDITION U/S
J-STD-020
8
0
ULTRASOUND
0147
24
125C
8
STORAGE LIFE
HRS
192
30C/60% R.H.
8
MOISTURE SOAK
HRS
3
235C +5/-0C
8
0
CONVECTION REFLOW
PASS
J-STD-020, 6.1a
8
0
EXTERNAL VISUAL
J-STD-020
8
0
PRECONDITION U/S
0
Total:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
125C, 6.0 VOLTS
70
0
HIGH VOLTAGE LIFE
HRS
0145
1000
125C, 6.0 VOLTS
77
0
HIGH VOLTAGE LIFE
HRS
0146
1000
125C, 6.0 VOLTS
77
0
HIGH VOLTAGE LIFE
HRS
0147
1000
125C, 5.5 VOLTS
77
0
HIGH TEMP OP LIFE
HRS
0324
988
125C, 5.5 VOLTS
77
0
HIGH TEMP OP LIFE
HRS
0324
0
Total:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
JESD22-B102
3
0
SOLDERABILITY
0145
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
0145
JESD22-B100
6
0
PHYSICAL DIMENSIONS
JESD22-B107
6
0
MARK PERMANENCY
JESD22-B105 TEST CONDITION B
6
0
LEAD INTEGRITY
JESD22-B102
3
0
SOLDERABILITY
0146
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
0146
JESD22-B100
6
0
PHYSICAL DIMENSIONS
JESD22-B107
6
0
MARK PERMANENCY
JESD22-B105 TEST CONDITION B
6
0
LEAD INTEGRITY
JESD22-B102
3
0
SOLDERABILITY
0147
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
0147
JESD22-B100
6
0
PHYSICAL DIMENSIONS
JESD22-B107
6
0
MARK PERMANENCY
JESD22-B105 TEST CONDITION B
6
0
LEAD INTEGRITY
0
Total:
PRECONDITIONING LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
24
125C
308
STORAGE LIFE
HRS
0145
192
30C/60% R.H.
308
MOISTURE SOAK
HRS
3
235C +5/-0C
308
0
CONVECTION REFLOW
PASS
24
125C
308
STORAGE LIFE
HRS
0146
192
30C/60% R.H.
308
MOISTURE SOAK
HRS
3
235C +5/-0C
308
0
CONVECTION REFLOW
PASS
24
125C
308
STORAGE LIFE
HRS
0147
192
30C/60% R.H.
308
MOISTURE SOAK
HRS
3
235C +5/-0C
308
0
CONVECTION REFLOW
PASS
0
Total:
TEMPERATURE CYCLE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
1000
-55C TO 125C
70
0
TEMP CYCLE
CYS
0145
1000
-55C TO 125C
77
0
TEMP CYCLE
CYS
0146
1000
-55C TO 125C
77
0
TEMP CYCLE
CYS
0147
0
Total:
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
44
0
HAST
HRS
0145
100
130C, 85%R.H.,5.5V
77
0
HAST
HRS
0146
100
130C, 85%R.H.,5.5V
77
0
HAST
HRS
0147
0
Total:
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY FAILS
DATE CODE
FA#
200
130C, 85% R.H.
44
0
HAST, NO BIAS
HRS
0145
200
130C, 85% R.H.
74
0
HAST, NO BIAS
HRS
0146
200
130C, 85% R.H.
73
0
HAST, NO BIAS
HRS
0147
0
Total:
FITS: 3.0
MTTF (YRS): 37651
FAILURE RATE:
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