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Datasheet: V18MLE0603L (Littelfuse)

Multilayer Transient Voltage Suppressor

 

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Littelfuse
3
SURF
A
CE MOUNT
V
ARIST
ORS
Surface Mount Varistors
133
w w w . l i t t e l f u s e . c o m
Multilayer Transient Voltage Suppressor
MLE Varistor Series
The MLE Series family of Transient Voltage Suppression devices are based
on the Littelfuse Multilayer fabrication technology. These components are
designed to suppress ESD events, including those specified in IEC 61000-
4-2 or other standards used for Electromagnetic Compliance testing. The
MLE Series is typically applied to protect integrated circuits and other
components at the circuit board level operating at 18VDC, or less.
The fabrication method and materials of these devices result in capaci-
tance characteristics suitable for high frequency attenuation/low-pass
filter circuit functions, thereby providing suppression and filtering in a
single device.
The MLE Series is manufactured from semiconducting ceramics and is sup-
plied in a leadless, surface mount package. The MLE Series is compatible
with modern reflow and wave soldering procedures.
Littelfuse Inc. manufactures other Multilayer Series products. See the ML
Series data sheet for higher energy/peak current transient applications. See
the AUML Series for automotive applications and the MLN Quad Array. For
high speed applications see the MHS series.
Features
Rated for ESD (IEC-61000-4-2)
Characterized for Impedance and Capacitance
-55
o
C to +125
o
C Operating Temperature Range
Leadless 0402, 0603, 0805, and 1206 sizes
Operating Voltages up to 18VM(DC)
Multilayer Ceramic Construction Technology
Applications
Protection of Components and Circuits Sensitive to ESD Transients
Occurring on Power Supplies, Control and Signal Lines
Suppression of ESD Events Such as Specified in IEC-61000-4-2 or
MIL-STD-883C Method-3015.7, for Electromagnetic Compliance (EMC)
Used in Mobile Communications, Computer/EDP Products, Medical
Products, Hand Held/Portable Devices, Industrial Equipment,
Including Diagnostic Port Protection and I/O Interfaces
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Multilayer Transient Voltage Suppressor
MLE Varistor Series
Surface Mount Varistors
134
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Absolute Maximum Ratings
For ratings of individual members of a series, see device ratings and specifications table.
Continuous:
Steady State Applied Voltage:
DC Voltage Range (VM(DC)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
V
Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
O
C
Storage Temperature Range (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
O
C
Device Ratings and Specifications
PART
NUMBER
MAX CONTINUOUS
WORKING VOLTAGE
-55
o
C TO 125
o
C
PERFORMANCE SPECIFICATIONS (25
o
C)
NOMINAL
VOLTAGE
TYPICAL
CAPACITANCE
AT 1MHz
MAXIMUM
LEAKAGE
(NOTE 1)
V
M(DC)
V
NOM
AT
1mA DC
I
L MAX
AT APPLIED
VOLTAGE
(V)
MIN (V)
MAX
(V)
(NOTE 3)
8kV CONTACT
Clamp
(V)
(NOTE 4)
15kV AIR
( pF)
(
A)
V
DC
V18MLE0603L
18
22
28
50
at 10A
<60
0.1
3.5
0.3
5.5
5.0
15
25
18
V18MLE0805
18
22
28
50
at 10A
<500
0.2
3.5
0.5
5.5
5.0
15
25
18
V18MLE0805L
18
22
28
50
at 10A
<100
0.2
3.5
0.5
5.5
5.0
15
25
18
V18MLE1206
18
22
28
50
at 10A
<1700
0.5
3.5
1.0
5.5
5.0
15
25
18
NOTES:
1. For applications of 18V
DC
or less. Higher voltages available, contact your Littelfuse Sales Representative.
2. Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
3. Direct discharge to device terminals (IEC preferred test method).
4. Corona discharge through air (represents actual ESD event).
5. Capacitance may be customized, contact your Littelfuse Sales Representative.
V18MLE0603
18
22
28
50
at 10A
<100
0.1
3.5
0.3
5.5
5.0
15
25
18
V18MLE0402
18
22
28
50
at 10A
<140
<75
<135
<65
<85
<160
<40
0.1
3.5
0.3
5.5
2
15
10
18
MAXIMUM
ESD CLAMP VOLTAGE (NOTE 2)
Clamp
(V)
MAXIMUM CLAMPING
VOLTAGE AT SPECIFIED
CURRENT (8/20
S)
(V)
Vc
<100
<70
<75
<65
<75
<125
NEW
MLE SERIES UNITS
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MLE Varistor Series
Surface Mount Varistors
Multilayer Transient Voltage Suppressor
135
w w w . l i t t e l f u s e . c o m
3
SURF
A
CE MOUNT
V
ARIST
ORS
FIGURE 4. IMPEDANCE (Z) vs FREQUENCY
TYPICAL CHARACTERISTIC
0.1
FREQUENCY (MHz)
IMPED
ANCE (Z)
10
100
1000
10000
1
10
100
0.01
-0402
-0603
-0805
-1206
Typical Performance Curves
For applications exceeding 125
0
C ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
30
10
0.0001
25
0.001
0.01
0.1
1
NUMBER OF PULSES
V
A
RIST
OR V
O
L
T
A
GE
(V)
FIGURE 3. STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
25
20
15
10
5
85
125
O
O
O
100
80
60
40
20
0
-55
50
60
70
80
90
100
110 120
130 140 150
PERCENT OF RA
TED
V
ALUE
AMBIENT TEMPERATURE (
o
C)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
FIGURE 2. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
25
0
1
CURRENT (A)
NOMINAL
V
O
L
T
A
GE A
T
1mADC
10
100
1000
10000
5
10
15
20
30
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Multilayer Transient Voltage Suppressor
MLE Varistor Series
Surface Mount Varistors
136
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Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) re-flow, vapour phase re-flow, and
wave soldering. When wave soldering, the MLE suppressor is attached
to the circuit board by means of an adhesive. The assembly is then
placed on a conveyor and run through the soldering process to contact
the wave. With IR and vapour phase re-flow, the device is placed in a
solder paste on the substrate. As the solder paste is heated, it reflows
and solders the unit to the board.
The recommended solder for the MLE suppressor is a 62/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402 size devices,
IR re-flow is recommended.
When using a reflow process, care should be taken to ensure that the
MLE chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solder's peak
temperature is essential to minimize thermal shock. Examples of the
soldering conditions for the MLE series of suppressors are given in the
tables below.
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause of
thermal shock is hot printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room temperature. The
boards must be allowed to cool gradually to less than 50
o
C before cleaning.
Termination Options
Littelfuse offers two types of electrode termination finish for the
MLE series:
1. Silver/Platinum (standard) (Not 0402 and 0603 sizes)
2. Silver/Palladium (optional)
FIGURE 6. WAVE SOLDER PROFILE
FIGURE 7. VAPOR PHASE SOLDER PROFILE
TEMPERA
TURE (
o
C)
TIME (MINUTES)
300
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260
o
C
SECOND PREHEAT
FIRST PREHEAT
TEMPERA
TURE (
o
C)
TIME (MINUTES)
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
RAMP RATE
PREHEAT ZONE
>50
o
C/s
MAXIMUM
TEMPERATURE 222
o
C
40-80
SECONDS
ABOVE 183
o
C
FIGURE 5. REFLOW SOLDER PROFILE
TEMPERA
TURE (
o
C)
TIME (MINUTES)
250
200
150
100
50
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
MAXIMUM
PREHEAT DWELL
PREHEAT ZONE
TEMPERATURE 222
o
C
RAMP RATE
<2
o
C/s
40-80
SECONDS
ABOVE 183
o
C
3. Nickel Barrier (optional for 0402-1210 package size)
(The ordering information section describes how to designate them.)
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MLE Varistor Series
Surface Mount Varistors
Multilayer Transient Voltage Suppressor
137
w w w . l i t t e l f u s e . c o m
3
SURF
A
CE MOUNT
V
ARIST
ORS
Recommended Pad Outline
C
B
A
NOTE: Avoid metal runs in this area.
NOTE
DIMENSION
RECOMMENDED PAD SIZE DIMENSIONS
1206 SIZE DEVICE
0805 SIZE DEVICE
0603 SIZE DEVICE
IN
MM
IN
MM
IN
MM
A
0.160
4.06
0.120
3.05
0.100
2.54
B
0.065
1.65
0.050
1.27
0.030
0.76
C
0.040
1.02
0.040
1.02
0.035
0.89
TABLE 1: PAD LAYOUT DIMENSIONS
0402 SIZE DEVICE
IN
MM
0.067
1.70
0.020
0.51
0.024
0.61
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