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Datasheet: 4015B (Intersil Corporation)

Cmos Dual 4-stage Static Shift Register With Serial Input/parallel Output

 

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Intersil Corporation
7-89
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright Intersil Corporation 1999
CD4015BMS
CMOS Dual 4-Stage Static Shift Register
With Serial Input/Parallel Output
Pinout
CD4015BMS
TOP VIEW
Functional Diagram
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
CLOCK B
Q4B
Q3A
Q2A
Q1A
RESET A
VSS
DATA A
VDD
RESET B
Q1B
Q2B
Q3B
Q4A
CLOCK A
DATA B
DATA A
CLOCK A
RESET A
DATA B
CLOCK B
RESET B
Q1A
Q2A
Q3A
Q4A
Q1B
Q2B
Q3B
Q4B
VSS
VDD
7
9
6
15
1
14
5
4
3
10
13
12
11
2
16
8
4
STAGE
4
STAGE
Features
High-Voltage Type (20V Rating)
Medium Speed Operation 12MHz (typ.) Clock Rate at
VDD - VSS = 10V
Fully Static Operation
8 Master-Slave Flip-Flops Plus Input and Output Buffering
100% Tested For Quiescent Current at 20V
5V, 10V and 15V Parametric Ratings
Standardized Symmetrical Output Characteristics
Maximum Input Current of 1
A at 18V Over Full Pack-
age-Temperature Range; 100nA at 18V and 25
o
C
Noise Margin (Full Package-Temperature Range) =
- 1V at VDD = 5V
- 2V at VDD = 10V
- 2.5V at VDD = 15V
Meets All Requirements of JEDEC Tentative Standard
No. 13B, "Standard Specifications for Description of
`B' Series CMOS Devices"
Applications
Serial-Input/Parallel-Output Data Queueing
Serial to Parallel Data Conversion
General-Purpose Register
Description
CD4015BMS consists of two identical, independent, 4-stage
serial-input/parallel output registers. Each register has inde-
pendent CLOCK and RESET inputs as well as a single serial
DATA input. "Q" outputs are available from each of the four
stages on both registers. All register stages are D type, mas-
ter-slave flip-flops. The logic level present at the DATA input
is transferred into the first register stage and shifted over one
stage at each positive-going clock transition. Resetting of all
stages is accomplished by a high level on the reset line.
Register expansion to 8 stages using one CD4015BMS
package, or to more than 8 stages using additional
CD4015BMS's is possible.
The CD4015BMS is supplied in these 16 lead outline pack-
ages:
Braze Seal DIP
H4X
Frit Seal DIP
H1F
Ceramic Flatpack
H6W
December 1992
File Number
3295
7-90
Specifications CD4015BMS
Absolute Maximum Ratings
Reliability Information
DC Supply Voltage Range, (VDD) . . . . . . . . . . . . . . . -0.5V to +20V
(Voltage Referenced to VSS Terminals)
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VDD +0.5V
DC Input Current, Any One Input
. . . . . . . . . . . . . . . . . . . . . . . .
10mA
Operating Temperature Range . . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Package Types D, F, K, H
Storage Temperature Range (TSTG) . . . . . . . . . . . -65
o
C to +150
o
C
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . +265
o
C
At Distance 1/16
1/32 Inch (1.59mm
0.79mm) from case for
10s Maximum
Thermal Resistance . . . . . . . . . . . . . . . .
ja
jc
Ceramic DIP and FRIT Package . . . . .
80
o
C/W
20
o
C/W
Flatpack Package . . . . . . . . . . . . . . . .
70
o
C/W
20
o
C/W
Maximum Package Power Dissipation (PD) at +125
o
C
For TA = -55
o
C to +100
o
C (Package Type D, F, K) . . . . . . 500mW
For TA = +100
o
C to +125
o
C (Package Type D, F, K) . . . . . Derate
Linearity at 12mW/
o
C to 200mW
Device Dissipation per Output Transistor . . . . . . . . . . . . . . . 100mW
For TA = Full Package Temperature Range (All Package Types)
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175
o
C
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS (NOTE 1)
GROUP A
SUBGROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Supply Current
IDD
VDD = 20V, VIN = VDD or GND
1
+25
o
C
-
10
A
2
+125
o
C
-
1000
A
VDD = 18V, VIN = VDD or GND
3
-55
o
C
-
10
A
Input Leakage Current
IIL
VIN = VDD or GND
VDD = 20
1
+25
o
C
-100
-
nA
2
+125
o
C
-1000
-
nA
VDD = 18V
3
-55
o
C
-100
-
nA
Input Leakage Current
IIH
VIN = VDD or GND
VDD = 20
1
+25
o
C
-
100
nA
2
+125
o
C
-
1000
nA
VDD = 18V
3
-55
o
C
-
100
nA
Output Voltage
VOL15
VDD = 15V, No Load
1, 2, 3
+25
o
C, +125
o
C, -55
o
C
-
50
mV
Output Voltage
VOH15
VDD = 15V, No Load (Note 3)
1, 2, 3
+25
o
C, +125
o
C, -55
o
C 14.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1
+25
o
C
0.53
-
mA
Output Current (Sink)
IOL10
VDD = 10V, VOUT = 0.5V
1
+25
o
C
1.4
-
mA
Output Current (Sink)
IOL15
VDD = 15V, VOUT = 1.5V
1
+25
o
C
3.5
-
mA
Output Current (Source)
IOH5A
VDD = 5V, VOUT = 4.6V
1
+25
o
C
-
-0.53
mA
Output Current (Source)
IOH5B
VDD = 5V, VOUT = 2.5V
1
+25
o
C
-
-1.8
mA
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1
+25
o
C
-
-1.4
mA
Output Current (Source)
IOH15
VDD = 15V, VOUT = 13.5V
1
+25
o
C
-
-3.5
mA
N Threshold Voltage
VNTH
VDD = 10V, ISS = -10
A
1
+25
o
C
-2.8
-0.7
V
P Threshold Voltage
VPTH
VSS = 0V, IDD = 10
A
1
+25
o
C
0.7
2.8
V
Functional
F
VDD = 2.8V, VIN = VDD or GND
7
+25
o
C
VOH >
VDD/2
VOL <
VDD/2
V
VDD = 20V, VIN = VDD or GND
7
+25
o
C
VDD = 18V, VIN = VDD or GND
8A
+125
o
C
VDD = 3V, VIN = VDD or GND
8B
-55
o
C
Input Voltage Low
(Note 2)
VIL
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
+25
o
C, +125
o
C, -55
o
C
-
1.5
V
Input Voltage High
(Note 2)
VIH
VDD = 5V, VOH > 4.5V, VOL < 0.5V
1, 2, 3
+25
o
C, +125
o
C, -55
o
C
3.5
-
V
Input Voltage Low
(Note 2)
VIL
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3
+25
o
C, +125
o
C, -55
o
C
-
4
V
Input Voltage High
(Note 2)
VIH
VDD = 15V, VOH > 13.5V,
VOL < 1.5V
1, 2, 3
+25
o
C, +125
o
C, -55
o
C
11
-
V
NOTES: 1. All voltages referenced to device GND, 100% testing being
implemented.
2. Go/No Go test with limits applied to inputs
3. For accuracy, voltage is measured differentially to VDD. Limit
is 0.050V max.
7-91
Specifications CD4015BMS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS (NOTE 1, 2)
GROUP A
SUBGROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Propagation Delay
Clock To Q
TPHL1
TPLH1
VDD = 5V, VIN = VDD or GND
9
+25
o
C
-
320
ns
10, 11
+125
o
C, -55
o
C
-
432
ns
Propagation Delay
Reset To Q
TPHL2
VDD = 5V, VIN = VDD or GND
9
+25
o
C
-
400
ns
10, 11
+125
o
C, -55
o
C
-
540
ns
Transition Time
TTHL
TTLH
VDD = 5V, VIN = VDD or GND
9
+25
o
C
-
200
ns
10, 11
+125
o
C, -55
o
C
-
270
ns
Maximum Clock Input
Frequency
FCL
VDD = 5V, VIN = VDD or GND
9
+25
o
C
3
-
MHz
10, 11
+125
o
C, -55
o
C
3/1.35
-
MHz
NOTES:
1. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
2. -55
o
C and +125
o
C limits guaranteed, 100% testing being implemented.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Supply Current
IDD
VDD = 5V, VIN = VDD or GND
1, 2
-55
o
C, +25
o
C
-
5
A
+125
o
C
-
150
A
VDD = 10V, VIN = VDD or GND
1, 2
-55
o
C, +25
o
C
-
10
A
+125
o
C
-
300
A
VDD = 15V, VIN = VDD or GND
1, 2
-55
o
C, +25
o
C
-
10
A
+125
o
C
-
600
A
Output Voltage
VOL
VDD = 5V, No Load
1, 2
+25
o
C, +125
o
C,
-55
o
C
-
50
mV
Output Voltage
VOL
VDD = 10V, No Load
1, 2
+25
o
C, +125
o
C,
-55
o
C
-
50
mV
Output Voltage
VOH
VDD = 5V, No Load
1, 2
+25
o
C, +125
o
C,
-55
o
C
4.95
-
V
Output Voltage
VOH
VDD = 10V, No Load
1, 2
+25
o
C, +125
o
C,
-55
o
C
9.95
-
V
Output Current (Sink)
IOL5
VDD = 5V, VOUT = 0.4V
1, 2
+125
o
C
0.36
-
mA
-55
o
C
0.64
-
mA
Output Current (Sink)
IOL10
VDD = 10V, VOUT = 0.5V
1, 2
+125
o
C
0.9
-
mA
-55
o
C
1.6
-
mA
Output Current (Sink)
IOL15
VDD = 15V, VOUT = 1.5V
1, 2
+125
o
C
2.4
-
mA
-55
o
C
4.2
-
mA
Output Current (Source)
IOH5A
VDD = 5V, VOUT = 4.6V
1, 2
+125
o
C
-
-0.36
mA
-55
o
C
-
-0.64
mA
Output Current (Source)
IOH5B
VDD = 5V, VOUT = 2.5V
1, 2
+125
o
C
-
-1.15
mA
-55
o
C
-
-2.0
mA
Output Current (Source)
IOH10
VDD = 10V, VOUT = 9.5V
1, 2
+125
o
C
-
-0.9
mA
-55
o
C
-
-1.6
mA
Output Current (Source)
IOH15
VDD =15V, VOUT = 13.5V
1, 2
+125
o
C
-
-2.4
mA
-55
o
C
-
-4.2
mA
Input Voltage Low
VIL
VDD = 10V, VOH > 9V, VOL < 1V
1, 2
+25
o
C, +125
o
C,
-55
o
C
-
3
V
7-92
Specifications CD4015BMS
Input Voltage High
VIH
VDD = 10V, VOH > 9V, VOL < 1V
1, 2
+25
o
C, +125
o
C,
-55
o
C
+7
-
V
Propagation Delay
Clock To Q
TPHL1
TPLH1
VDD = 10V
1, 2, 3
+25
o
C
-
160
ns
VDD = 15V
1, 2, 3
+25
o
C
-
120
ns
Propagation Delay
Reset To Q
TPHL2
VDD = 10V
1, 2, 3
+25
o
C
-
200
ns
VDD = 15V
1, 2, 3
+25
o
C
-
160
ns
Transition Time
TTHL
TTLH
VDD = 10V
1, 2, 3
+25
o
C
-
100
ns
VDD = 15V
1, 2, 3
+25
o
C
-
80
ns
Maximum Clock Input
Frequency
FCL
VDD = 10V
1, 2, 3
+25
o
C
6
-
MHz
VDD = 15V
1, 2, 3
+25
o
C
8.5
-
MHz
Minimum Data Setup
Time
TS
VDD = 5V
1, 2, 3
+25
o
C
-
70
ns
VDD = 10V
1, 2, 3
+25
o
C
-
40
ns
VDD = 15V
1, 2, 3
+25
o
C
-
30
ns
Clock Rise and Fall Time
TRCL
TFCL
VDD = 5V
1, 2, 3
+25
o
C
-
15
s
VDD = 10V
1, 2, 3
+25
o
C
-
15
s
VDD = 15V
1, 2, 3
+25
o
C
-
15
s
Minimum Clock Pulse
Width
TWCL
VDD = 5V
1, 2, 3
+25
o
C
-
180
ns
VDD = 10V
1, 2, 3
+25
o
C
-
80
ns
VDD = 15V
1, 2, 3
+25
o
C
-
50
ns
Minimum Reset Pulse
Width
TWR
VDD = 5V
2, 3
+25
o
C
-
200
ns
VDD = 10V
2, 3
+25
o
C
-
80
ns
VDD = 15V
2, 3
+25
o
C
-
60
ns
Input Capacitance
CIN
Any Input
1, 2
+25
o
C
-
7.5
pF
NOTES:
1. All voltages referenced to device GND.
2. The parameters listed on Table 3 are controlled via design or process and are not directly tested. These parameters are characterized
on initial design release and upon design changes which would affect these characteristics.
3. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Supply Current
IDD
VDD = 20V, VIN = VDD or GND
1, 4
+25
o
C
-
25
A
N Threshold Voltage
VNTH
VDD = 10V, ISS = -10
A
1, 4
+25
o
C
-2.8
-0.2
V
N Threshold Voltage
Delta
VNTH
VDD = 10V, ISS= -10
A
1, 4
+25
o
C
-
1
V
P Threshold Voltage
VPTH
VSS = 0V, IDD = 10
A
1, 4
+25
o
C
0.2
2.8
V
P Threshold Voltage
Delta
VPTH
VSS = 0V, IDD = 10
A
1, 4
+25
o
C
-
1
V
Functional
F
VDD = 18V, VIN = VDD or GND
1
+25
o
C
VOH >
VDD/2
VOL <
VDD/2
V
VDD = 3V, VIN = VDD or GND
Propagation Delay Time
TPHL
TPLH
VDD = 5V
1, 2, 3, 4
+25
o
C
-
1.35 x
+25
o
C
Limit
ns
NOTES: 1. All voltages referenced to device GND.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns.
3. See Table 2 for +25
o
C limit.
4. Read and Record
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
(Continued)
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
LIMITS
UNITS
MIN
MAX
7-93
Specifications CD4015BMS
TABLE 5. BURN-IN AND LIFE TEST DELTA PARAMETERS +25
O
C
PARAMETER
SYMBOL
DELTA LIMIT
Supply Current - MSI-2
IDD
1.0
A
Output Current (Sink)
IOL5
20% x Pre-Test Reading
Output Current (Source)
IOH5A
20% x Pre-Test Reading
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUP
MIL-STD-883
METHOD
GROUP A SUBGROUPS
READ AND RECORD
Initial Test (Pre Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 1 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
Interim Test 2 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
PDA (Note 1)
100% 5004
1, 7, 9, Deltas
Interim Test 3 (Post Burn-In)
100% 5004
1, 7, 9
IDD, IOL5, IOH5A
PDA (Note 1)
100% 5004
1, 7, 9, Deltas
Final Test
100% 5004
2, 3, 8A, 8B, 10, 11
Group A
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B
Subgroup B-5
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6
Sample 5005
1, 7, 9
Group D
Sample 5005
1, 2, 3, 8A, 8B, 9
Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
MIL-STD-883
METHOD
TEST
READ AND RECORD
PRE-IRRAD
POST-IRRAD
PRE-IRRAD
POST-IRRAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
1, 9
Table 4
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
FUNCTION
OPEN
GROUND
VDD
9V
-0.5V
OSCILLATOR
50kHz
25kHz
Static Burn-In 1
Note 1
2 - 5, 10 - 13
1, 6 - 9, 14, 15
16
Static Burn-In 2
Note 1
2 - 5, 10 - 13
8
1, 6, 7, 9, 14 - 16
Dynamic Burn-
In Note 1
-
6, 8, 14
16
2 - 5, 10 - 13
1, 9
7, 15
Irradiation
Note 2
2 - 5, 10 - 13
8
1, 6, 7, 9, 14 - 16
NOTE:
1. Each pin except VDD and GND will have a series resistor of 10K
5%, VDD = 18V
0.5V
2. Each pin except VDD and GND will have a series resistor of 47K
5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V
0.5V
94
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
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Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
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Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
Specifications CD4015BMS
Logic Diagram
FIGURE 1. CD4015BMS LOGIC DIAGRAM
TRUTH TABLE
CL
D
R
Q1
Qn
0
0
0
Qn-1
1
0
1
Qn-1
X
0
Q1
Qn
(No Change)
X
X
1
0
0
X = Don't care Case
D
Q
Q
CL
R
p
n
CL
CL
D
D Q
CL Q
R
CL
CL
Q
D
Q
Q
CL
R
D
Q
Q
CL
R
D
Q
Q
CL
R
p
n
CL
CL
p
n
CL
CL
p
n
CL
CL
VDD
VSS
CL
R
Q
13
Q1
(5)
12
Q2
(4)
11
Q3
(3)
2
Q4
(10)
15
DATA
(7)
*
1
CLOCK
(9)
*
14
RESET
(6)
*
*
ALL INPUTS ARE PROTECTED
BY CMOS PROTECTION
NETWORK
7-95
CD4015BMS
Typical Performance Characteristics
FIGURE 2. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 3. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 4. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
FIGURE 5. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
FIGURE 6. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE
FIGURE 7. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
10V
5V
AMBIENT TEMPERATURE (T
A
) = +25
o
C
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
0
5
10
15
15
10
5
20
25
30
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
AMBIENT TEMPERATURE (T
A
) = +25
o
C
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
10V
5V
OUTPUT LOW (SINK) CURRENT (IOL) (mA)
15
12.5
10
7.5
5
2.5
0
5
10
15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-10V
-15V
AMBIENT TEMPERATURE (T
A
) = +25
o
C
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
0
-5
-10
-15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
-20
-25
-30
0
-5
-10
-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
-10V
-15V
AMBIENT TEMPERATURE (T
A
) = +25
o
C
0
-5
-10
-15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
0
-5
-10
-15
OUTPUT HIGH (SOURCE) CURRENT (IOH) (mA)
GATE-TO-SOURCE VOLTAGE (VGS) = -5V
AMBIENT TEMPERATURE (T
A
) = +25
o
C
LOAD CAPACITANCE (CL) (pF)
0
40
60
80
100
20
0
50
100
150
200
SUPPLY VOLTAGE (VDD) = 5V
10V
15V
TRANSITION TIME (tTHL, tTLH) (ns)
AMBIENT TEMPERATURE (T
A
) = +25
o
C
LOAD CAPACITANCE (CL) (pF)
0
40
60
80
100
20
50
100
150
200
SUPPLY VOLTAGE (VDD) = 5V
PROP
AGA
TION DELA
Y TIME (tPHL, tPLH) (ns)
15V
10V
250
7-96
CD4015BMS
Chip Dimensions and Pad Layout
FIGURE 8.
TYPICAL POWER DISSIPATION AS
A FUNCTION OF FREQUENCY
Typical Performance Characteristics
(Continued)
CL = 50pF
CL = 15pF
AMBIENT TEMPERATURE (T
A
) = +25
o
C
SUPPLY VOLTAGE (VDD) = 15V
10V
5V
10V
tr, tf = 20ns
RL = 200k
1
2
4 6 8
10
2
4 6 8
10
2
2
4 6 8
10
3
2
4
6 8
10
4
2
4 6 8
CLOCK INPUT FREQUENCY (fCL) (kHz)
10
5
10
10
2
2
8
6
4
10
3
2
8
6
4
10
4
2
8
6
4
10
5
2
8
6
4
POWER DISSIP
A
TION (PD) (
W)
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10
-3
inch)
METALLIZATION: Thickness: 11k
-
14k
, AL.
PASSIVATION: 10.4k - 15.6k
, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
DIE SIZE: X = 80 (77 - 85) = (1.956 - 2.159)
Y = 98 (95 - 103) = (2.413 - 2.616)
13
3
14
15
12
11
10
2
1
16
4
5
6
7
8
9
98
80
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