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Datasheet: V23814-Z6-Z1 (Infineon Technologies AG)

Heatsink For Paroli Backplane Module

 

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Infineon Technologies AG

Document Outline

Data Sheet
1
2003-07-25
Heatsink for PAROLI
Backplane Module
V23814-Z6-Z1
Fiber Optics
PAROLI
is a registered trademark of Infineon Technologies
1
General Scope
This data sheet describes the detachable heatsink for PAROLI
Backplane module
V23814-x1306-M133
1)
(transmitter) resp. V23815-x1306-M133
1)
(receiver).
2
Technical Data
See
Figure 1
.
3
Application and Assembly
Application is the use of the heatsink to attach onto the module baseplate.
For optimized heat transfer between module and heatsink Infineon recommends to use
a heat dissipation foil between both parts (e.g. Panasonic PGS 0.1 mm thickness).
Dimensions see
Figure 2
.
The fixing is done by two screws.
Recommendation for screw dimensions: ISO 7045 - M1.6 x 6 - A2 50 - H.
The screws have to be fixed with 10 Ncm.
1)
x = K for 1.25 Gbit/s
x = U for 1.6 Gbit/s
x = Q for 2.7 Gbit/s
Dimensions
45 x 24 x 8.75
0.2 mm (L x W x H)
Material
Al Mg 4.5 Mn, black anodized
Coefficient of thermal conduction
110...140 W m
1
K
1
No. of fins
14 (1.4 mm width)
V23814-Z6-Z1
Package Outlines
Data Sheet
2
2003-07-25
4
Package Outlines
Figure 1
Heatsink PAROLI Backplane Module
Figure 2
Heat Dissipation Foil
File: 3204
Dimensions in mm
File: 3205
Dimensions in mm
Material:
Thermal Graphit Foil
0.1 mm thick
Edition 2003-07-25
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 Mnchen, Germany
Infineon Technologies AG 2003.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
V23814-Z6-Z1

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2003-07-25
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