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Datasheet: HMC157C8 (Hittite Microwave Corporation)

Gaas Mmic Smt Frequency Doubler 1 - 2 Ghz Input

 

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Hittite Microwave Corporation
MICROWAVE CORPORATION
F
EBRUARY
2001
3 - 14
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Web Site: www.hittite.com
M
UL
TIPLIERS
3
SMT
Features
CONVERSION LOSS: 17 dB
Fo, 3Fo, 4Fo ISOLATION: > 35 dB
INPUT DRIVE LEVEL: 10 to 20 dBm
General Description
The HMC157C8 is a miniature frequency
doubler in a non-hermetic ceramic surface
mount package. Suppression of undesired
fundamental and higher order harmonics is
32 to 60 dB with respect to input signal level
and 15 to 43 dB with respect to the desired
output signal level. The doubler uses the
same diode/balun technology used in Hittite
MMIC mixers, features small size and re-
quires no DC bias.
Typical Performance vs. Drive Level
10
15
20
dBm
Input Frequency Range
1.5 - 2.0
1.0 - 2.0
1.0 - 2.0
GHz
Output Frequency Range
3.0 - 4.0
2.0 - 4.0
2.0 - 4.0
GHz
Conversion Loss
<20
<17
<18
dB
Performance for Input Signals in the 1.0 - 2.0 GHz Band (+15dBm Drive)
Min.
Typ.
Max.
Fo Isolation (with respect to input level)
42
50
dB
3Fo Isolation (with respect to input level)
40
50
dB
4Fo Isolation (with respect to input level)
30
35
dB
Guaranteed Performance,
50 Ohm system -55 to +85 deg C
GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT
HMC157C8
V01.0700
MICROWAVE CORPORATION
F
EBRUARY
2001
3 - 15
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Web Site: www.hittite.com
3
M
UL
TIPLIERS
SMT
GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT
-50
-40
-30
-20
-10
0
2
2.5
3
3.5
4
4.5
5
Input=+10dBm
Input=+15dBm
Input=+20dBm
C
O
NVE
R
SI
O
N
G
A
I
N
(
d
B)
OUTPUT FREQUENCY (GHz)
-30
-25
-20
-15
-10
-5
0
1
2
3
4
5
6
7
Input=+10dBm
Input=+15dBm
Input=+20dBm
IN
P
U
T
R
E
T
U
R
N
L
O
S
S
(
d
B
)
INPUT FREQUENCY (GHz)
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
1
2
3
4
5
6
7
Input=+10dBm
Input=+15dBm
Input=+20dBm
O
U
T
P
U
T
RE
T
U
RN
L
O
S
S
(
d
B)
FREQUENCY (GHz)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
1
2
3
4
5
6
7
8
9
10
Fo
3Fo
4Fo
IS
O
L
ATIO
N
(
d
B
)
FREQUENCY (GHz)
Conversion Loss vs. Drive Level
Input Return Loss vs. Drive level
Isolation @ +15 dBm Drive Level *
Output Return Loss vs. Drive Level
* With respect to input level
HMC157C8
V01.0700
MICROWAVE CORPORATION
F
EBRUARY
2001
3 - 16
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Web Site: www.hittite.com
M
UL
TIPLIERS
3
SMT
Schematic
Absolute Maximum Ratings
Input Drive
+27 dBm
Storage Temperature
-65 to +150 deg C
Operating Temperature
-55 to +125 deg C
Outline Drawing
RF
OUT
RF
IN
PIN 1
PIN 8
0 DEG.
RF GND PLANE
0.157/0.163
0.282/0.298
(3.99/4.14)
(7.16/7.57)
(0.18/0.23)
(0.51/1.02)
(2.41)
COPLANARITY
MAX.
0.197/0.203
(5.00/5.16)
(0.18/0.23)
(0.51 +/- 0.08)
(1.27)
(3.48/3.63)
0.137/0.143
0.020 +/- 0.003 TYP
0.007/0.009 TYP
CHAMFERED
COPLANAR WITH LEADS
0.020/0.040
0.050 TYP
0.177/0.183
0.095
TO 7 DEG.
0.004 (0.10)
MAX.
GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT
RF OUT
RF IN
(PIN 2)
(PIN 7)
1.
MATERIAL:
A) PACKAGE BODY & COVER : WHITE ALUMINA (92%)
B) LEADS & PACKAGE BOTTOM: COPPER
2 .
PLATING : ELECTROLYTIC GOLD 100 - 200 MICROINCHES
OVER ELECTROLYTIC NICKEL 100 TO 200 MICROINCHES.
3.
DIMENSIONS ARE IN INCHES (MILLIMETERS).
UNLESS OTHERWISE SPECIFIED TOL. ARE 0.005(0.13).
4.
ALL UNLABELED LEADS ARE GROUND. THESE LEADS ARE
CONNECTED INTERNALLY TO THE PACKAGED BOTTOM GROUND.
THE PACKAGE BOTTOM RF GROUND MUST BE SOLDERED TO
THE PCB RF GROUND.
5.
PACKAGE LENGTH AND WIDTH DIMENSIONS SHOWN DO NOT INCLUDE
LID SEAL PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.005
(0.127MM) PER SIDE.
HMC157C8
V01.0700
MICROWAVE CORPORATION
F
EBRUARY
2001
3 - 17
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Web Site: www.hittite.com
3
M
UL
TIPLIERS
SMT
NOTES:
GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT
HMC157C8
V01.0700
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