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Datasheet: HMC141C8 (Hittite Microwave Corporation)

Gaas Mmic Smt Doublebalanced Mixer, 6 - 15 Ghz

 

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Hittite Microwave Corporation
MICROWAVE CORPORATION
12 - 10
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
HMC141C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 6 - 15 GHz
v02.0302
General Description
Features
Functional Diagram
Input IP3: +21 dBm
Conversion Loss: 8.5 dB
LO to RF Isolation: 35 dB
Electrical Specifi cations,
T
A
= +25 C, LO Drive = +15 dBm
Typical Applications
The HMC141C8 is ideal for:
Microwave Pt to Pt Radios
VSAT Ground Equipment
The HMC141C8 is a miniature passive double-
balanced mixer in a non-hermetic ceramic sur-
face mount package that can be used as an
upconverter or downconverter. The device is a
passive diode/balun type mixer with high dynamic
range. The mixer can handle larger signal levels
than most active mixers due to the high third
order intercept of 20 dBm. MMIC implementation
provides exceptional balance in the circuit result-
ing in high LO/RF and LO/IF isolations and unit-
to-unit consistency. This mixer has applications
where small size and surface mount compatibility
are important.
Parameter
Min.
Typ.
Max.
Units
Frequency Range, RF & LO
6 - 15
GHz
Frequency Range, IF
DC - 2
GHz
Conversion Loss
7 - 11 GHz
6 - 18 GHz
8.5
10
10
12
dB
dB
Noise Figure (SSB)
8.5
10
dB
LO to RF Isolation
28
35
dB
LO to IF Isolation
17
25
dB
IP3 (Input)
20
dBm
IP2 (Input)
45
dBm
1 dB Gain Compression (Input)
10
dBm
MICROWAVE CORPORATION
12 - 11
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
-20
-15
-10
-5
0
CONVERSION LOSS (dB)
2
3
4
5
6
7
8
9
10 11 12 13 14 15
FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
ISOLATION (dB)
3
4
5
6
7
8
9
10 11
12 13
14 15
FREQUENCY (GHz)
RF/IF
LO/IF
LO/RF
Conversion Loss
Isolation
-15
-12.5
-10
-7.5
-5
CONVERSION LOSS (dB)
2
3
4
5
6
7
8
9
10 11 12 13 14 15
FREQUENCY (GHz)
+17 dBm
+15 dBm
+13 dBm
+10 dBm
Conversion Loss vs LO Power
v02.0302
HMC141C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 6 - 15 GHz
-60
-50
-40
-30
-20
ISOLATION (dB)
2
3
4
5
6
7
8
9
10 11 12 13 14 15
FREQUENCY (GHz)
+17 dBm
+15 dBm
+13dBm
+10 dBm
-25
-20
-15
-10
-5
0
RETURN LOSS (dB)
2
3
4
5
6
7
8
9
10 11 12 13 14 15
FREQUENCY (GHz)
LO
RF
IF
Return Loss
Isolation vs LO Drive Level
Distortion and 1dB
Compression vs. LO Drive Level
Distortion
LO
Drive
RF (f1)= 11.01 GHz
RF (f2)= 11.00 GHz
LO= 11.5 GHz
RF Level= 0 dBm
1 dB
Compression
(dBm)
IP3 (dBm)
IP2 (dBm)
P1dB (dBm)
+13
18
42
7
+15
21
45
10
+17
21
45
10
MICROWAVE CORPORATION
12 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
Outline Drawing
Absolute Maximum Ratings
v02.0302
HMC141C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 6 - 15 GHz
RF/IF Input
+13 dBm
LO Drive
+27 dBm
Storage Temperature
-65 to +150 C
Operating Temperature
-55 to +85 C
NOTES:
1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92%
2. LEAD, PACKAGE BOTTOM MATERIAL: COPPER
3. PLATING: ELECTROLYTIC GOLD 100-200 MICROINCHES, OVER
ELECTROLYTIC NICKEL 100-250 MICROINCHES.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. PACKAGE LENGTH AND WIDTH DIMENSIONS DO NOT INCLUDE LID
SEAL PROTRUSION .005 PER SIDE.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
MICROWAVE CORPORATION
12 - 13
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - SMT
12
v02.0302
HMC141C8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 6 - 15 GHz
Evaluation PCB
List of Material
Item
Description
J1 - J3
PC Mount SMA RF Connector
U1
HMC141C8 Mixer
PCB*
107214 Evaluation Board
* Circuit Board Material: Rogers 4350
The circuit board used in the fi nal application should
use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads and exposed paddle should be connected
directly to the ground plane similar to that shown. A
suffi cient number of VIA holes should be used to con-
nect the top and bottom ground planes. The evalua-
tion circuit board shown is available from Hittite upon
request.
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