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Datasheet: HMC141 (Hittite Microwave Corporation)

Gaas Mmic Double-balanced Mixer, 6 - 18 Ghz

 

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Hittite Microwave Corporation
MICROWAVE CORPORATION
5 - 20
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - CHIP
5
GaAs MMIC DOUBLE-BALANCED
MIXER, 6 - 18 GHz
v01.0801
General Description
Features
Functional Diagram
Input IP3: +21 dBm
LO / RF Isolation: 25 to 40 dB
IF Bandwidth: DC to 6 GHz
Small Size: 1.48mm x 1.48mm
Electrical Specifi cations,
T
A
= +25 C, LO Drive = +20 dBm
Typical Applications
The HMC141 & HMC142 is ideal for:
UNII & HiperLAN
Microwave & MMW Radios
Military, Space & Test Equipment
The HMC141 chip is a minature double-balanced
mixer which can be used as an upconverter or
downconverter. The HMC142 is identical to the
HMC141 except that the layout is a mirror image
designed to ease integration into image-reject
mixer modules. Broadband operation and excel-
lent isolations are provided by on-chip baluns,
which require no external components and no DC
bias. The design is similar to the HMC143/144
mixers but without an IF combiner, providing a
broad DC to 6 GHz IF bandwidth. These devices
are much smaller and more reliable than hybrid
diode mixers for VSAT and point-to-point radios.
HMC141 / HMC142
Parameter
Min.
Typ.
Max.
Units
Frequency Range, RF & LO
6 - 18
GHz
Frequency Range, IF
DC - 6
GHz
Conversion Loss
10
12
dB
Noise Figure (SSB)
10
12
dB
LO to RF Isolation
20
25
dB
LO to IF Isolation
20
25
dB
IP3 (Input)
16
21
dBm
IP2 (Input)
40
47
dBm
1 dB Gain Compression (Input)
5
10
dBm
MICROWAVE CORPORATION
5 - 21
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - CHIP
5
-30
-25
-20
-15
-10
-5
0
CONVERSION LOSS (dB)
0
5
10
15
20
25
FREQUENCY (GHz)
-60
-50
-40
-30
-20
-10
0
0
5
10
15
20
25
30
ISOLATION (dB)
FREQUENCY (GHz)
LO/RF
LO/IF
RF/IF
Conversion Loss
Isolation
-50
-40
-30
-20
-10
0
CONVERSION LOSS (dB)
LO POWER (dBm)
6 GHz
10 GHz
14 GHz
18 GHz
6
8
10
12
14
16
18
20
22
Upconverter Performance
v01.0801
GaAs MMIC DOUBLE-BALANCED
MIXER, 6 - 18 GHz
Conversion Loss vs. LO Drive Level
@ Several RF Frequencies
Input at IF Port (1-8 GHz); Output at LO Port (9 GHz)
Local Oscillator at RF Port (10-17 GHz)
-60
-50
-40
-30
-20
-10
0
RESPONSE (dB)
0
2
4
6
8
10
IF FREQUENCY (GHz)
CONVERSION GAIN
INPUT/OUTPUT ISOLATION
HMC141 / HMC142
MICROWAVE CORPORATION
5 - 22
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - CHIP
5
v01.0801
GaAs MMIC DOUBLE-BALANCED
MIXER, 6 - 18 GHz
-25
-20
-15
-10
-5
0
LO RETURN LOSS (dB)
LO FREQUENCY (GHz)
0
5
10
15
20
25
LO Return Loss
Distortion and 1dB Compression
versus LO Drive Level
RF Return Loss
IF Return Loss
-25
-20
-15
-10
-5
0
0
5
10
15
20
25
RF RETURN LOSS (dB)
RF FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
IF RETURN LOSS (dB)
0
2
4
6
8
10
IF FREQUENCY (GHz)
HMC141 / HMC142
Absolute Maximum Ratings
Distortion
LO
Drive
RF (f1) = 11.01 GHz
RF (f2) = 11.00 GHz
LO = 11.5 GHz
RF Level = 0 dBm
1 dB
Compression
(dBm)
IP3 (dBm)
IP2 (dBm)
P1dB (dBm)
+13
18
42
7
+15
21
45
10
+17
21
45
10
LO Drive
+27 dBm
Storage Temperature
-65 to +150 C
Operating Temperature
-55 to +85 C
MICROWAVE CORPORATION
5 - 23
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MIXERS - CHIP
5
Outline Drawings
(See HMC141/142 Operation Application Note in Section 15)
v01.0801
GaAs MMIC DOUBLE-BALANCED
MIXER, 6 - 18 GHz
HMC141
HMC142
HMC141 / HMC142
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004".
3. TYPICAL BOND PAD IS .004" SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
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