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Datasheet: B10-05 (No company)

RF Relays / BGA Surface Mount / Ability to pass GHz signals IC Testers

 

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No company
40
COTO TECHNOLOGY (USA) Tel: (401) 943-2686 / Fax (401) 942-0920
6 (Europe) Tel: +31-45-5439343 / Fax +31-45-5427216
B10 RF Relays
Ball Grid Array Relays
Coto's Ball Grid Array (BGA) construction offers a breakthrough in
reed relay performance. This patented technology
1
allows for shorter
RF paths in a controlled 50
environment to minimize signal
attentuation. The designer is now able to switch or pass signals with
wider bandwidth and faster rise time than alternative technologies.
This is particularly important in Mixed Signal IC testers. BGA packag-
ing allows relays to be integrated easily on boards designed for surface
mount processing.
Series Features
Applications
BGA Surface Mount
IC Testers
Ability to pass GHz signals
In-Line Relay Testers
Rise time < 40
Sec
Memory Testers
50
Characteristic Impedance
Mixed Signal Testers
Low Capacitance
High Bandpass Applications
Patented Design
1
Dimensions in Inches
(Millimeters)
Notes:
1
Protected by one or more of the following
US Patents:
6025768, 6052045, 6294971,
6683518, RE38381 and other foreign patents.
41
For Most Recent Data, Consult the Coto Technology Website: www.cotorelay.com
6 E-mail: info@cotorelay.com
B10 RF Relays
NOTES:
1
All parameters specified per EIA/NARM standards
for dry reed relays, # RS-421 and RS-436, if a
suitable parametric standard exists.
2
Unless otherwise noted, all parameters are specified
at 25C and 40% RH.
3
Life expectancies based on characteristic life
(63.2% failure) calculated from the 2-parameter
Weibull distribution. Contact resistance >2.0
defines end of life.
4
Frequency at which the difference between output
and input signal amplitude exceeds -3dB. (Direct
wired using 50
coaxial cable.)
ENVIRONMENTAL RATINGS:
Storage Temperature: -35C to +100C.
Operating Temperature: -20C to +85C.
Vibration: sinusoidal vibration with an amplitude of
10G over a 10Hz to 2000Hz frequency range shall
not cause a closed channel activated at the nominal
coil voltage to open, not an open channel to close.
Max Soldering Temperature: 226C (438F) max for
1 minute dwell time. Temperature measured at a
relay ball termination.
B10
Test Parameters
Conditions
1,2
Min
Typ
Max
Units
Coil Resistance
49.5
55.0
60.5
Nominal Voltage
3.3V Coil
5.0
4.0
Volts DC
Must Operate Voltage
2.4
Volts DC
Must Release Voltage
0.4
Volts DC
Coil Resistance
135.0
150.0
165.0
Nominal Voltage
5V Coil
5.0
6.0
Volts DC
Must Operate Voltage
3.8
Volts DC
Must Release Voltage
0.4
Volts DC
Switching Voltage
Max DC/Peak AC
125
Volts
Switching Current
0.25
Amps
Carry Current (Continuous)
Switch and Shield
0.5
Amps
Contact Rating (Resistive Load)
Resistive Load
3.0
Watts
Life Expectancy
Signal Switching
3
1VDC / 10mA
1000
x 10
6
Ops
Resistive Load
3
12VDC / 10mA
1
x 10
6
Ops
Other Load Conditions
3
Consult Factory
Static Contact Resistance (initial)
0.05VDC / 10mA
0.125
Dynamic Contact Resistance (initial)
0.5V / 50mA 100 Hz, 1.5 mSec
0.150
Insulation Res
All Isolated Pins
100VDC
10
!
10
10
12
Capacitance
Across Contacts
Shield Guarding
0.2
pF
Capacitance
Open Contact to Coil
Shield Guarding
0.5
pF
Capacitance
Closed Contact to Coil
Shield Guarding
1
pF
Across Contacts
100 A
150
V (DC/Pk AC)
Dielectric
Contact to Coil
100 A
1500
V (DC/Pk AC)
Strength
Contact to Shield
100 A
1500
V (DC/Pk AC)
Operate Time
(including bounce)
Nominal Voltage coil drive @ 30 Hz,
100
200
Sec
Release Time
(Si diode damped)
square wave
30
50
Sec
RF Insertion Loss
4
-3 dB roll-off frequency
10.0
GHz
Signal Rise Time (10% - 90%)
Corrected for measurement
40
pSec
system response time
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