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Datasheet: B20C3200-2200 (Diotec Semiconductor)

 

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Diotec Semiconductor
MECHANICAL DATA
FEATURES
Data Sheet No. BRSB-500-1C
MECHANICAL SPECIFICATION
Case: Molded plastic, U/L Flammability Rating 94V-0
Terminals: Round silver plated pins
Soldering: Per MIL-STD 202 Method 208 guaranteed
Polarity: Marked on case
Mounting Position: Any
Weight: 0.38 Ounces (10.6 Grams)
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive loads, derate current by 20%.
Average Forward Rectified Current @ T = 55 C
A
o
PARAMETER (TEST CONDITIONS)
Maximum DC Blocking Voltage
Maximum Peak Recurrent Reverse Voltage
Maximum RMS Voltage
Series Number
I
O
V
RMS
V
RRM
V
RM
SYMBOL
RATINGS
UNITS
VOLTS
SB
SB
SB
SB
SB
SB
SB
50
100
200
400
1000
35
70
140
280
700
5
Peak Forward Surge Current.
T = 150 C
J
O
Single 60Hz Half-Sine Wave
Superimposed on Rated Load (JEDEC Method).
Maximum Forward Voltage (Per Diode) at 5 Amps DC
VOLTS
AMPS
V
FM
I
FSM
200
1.0 (Typical < 0.95)
Typical Thermal Resistance
Maximum Average DC Reverse Current
At Rated DC Blocking Voltage
I
RM
R
JA
R
JL
C/W
A
@ T = 25 C
A
o
@ T = 100 C
A
o
1
50
17
3.3
E21
Junction Operating Temperature Range
T T
J,
STG
C
-55 to +150
3.01 05sb
(1) Unit mounted on 3.0" sq. x 0.11" (7.5cm sq. x 0.3cm) aluminum plate
NOTES:
600
800
50
100
200
400
1000
600
800
420
560
500
501
502
504
506
508
510
C1
B2
B1
B1
D1
C
B
A1
L
D
A
AC
+
_
C
D1
C1
0.400
10.2
2.06
0.070
D
1.27
0.05
39.9
4.8
1.570
0.188
L
1.0*
25.4*
6.4
0.250
7.6
0.300
A
A1
B
B1
B2
* This measurement is a "Minimum"
21.7
0.855
0.820
21.0
SYM
TYP
TYP
MAX
MAX
INCHES
SB5 PACKAGE SHOWN ACTUAL SIZE
SERIES SB500 - SB510
SB506
712
+
_
Junction to Ambient (Note 1)
Junction to Lead (Note 1)
BUILT-IN STRESS RELIEF MECHANISM FOR
SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 200 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
RELIABLE LOW-COST MOLDED PLASTIC CONSTRUCTION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
RATING & CHARACTERISTIC CURVES FOR SERIES SB500 - SB510
Data Sheet No. BRSB-500-2C
Tel.: (310) 767-1052
Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
Gardena, CA 90248
U.S.A
18020 Hobart Blvd., Unit B
Number of Cycles at 60 Hz
5 AMP SILICON BRIDGE RECTIFIERS
3.01 05sb
FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
1
10
100
250
200
150
100
50
0
NOTE 2
E22
NOTES
(3) T = 25 C; Pulse Width = 300 Sec; 1% Duty Cycle
(1) Bridge Mounted on 3.0" sq. x 0.11" (7.5cm sq. x 0.3cm) Aluminum Plate
(2) T = 150 C
J
o
J
o
FIGURE 4. TYPICAL REVERSE CHARACTERISTICS
Percent of Rated Peak Reverse Voltage
.01
0.1
1.0
10
100
120
140
20
40
0
60
80
FIGURE 1. FORWARD CURRENT DERATING CURVE
Ambient Temperature, C
o
60Hz Resistive or Inductive Loads
FIGURE 3. TYPICAL FORWARD CHARACTERISTIC PER DIODE
Instantaneous Forward Voltage (Volts)
0.01
0.1
1.0
10
100
NOTE 2
T = 25 C
J
o
NOTE 1
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