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Datasheet: RR0816(0603) (Cyntec Co., Ltd.)

Thin Film Chip Resistor

 

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CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 1 OF 11
0603 Series Thin Film Chip Resistor
1. Scope
This specification applies to 0.8mm x 1.6mm (0603) size, fixed metal chip resistors rectangular
type for use in electronic equipment.
2. Type Designation
RR0816 X
--
XXX
--
X
N
(1) (2)
(3)
(4)
(5)

Where (1) Series No.
(2) Tolerance of TCR :
P =
25ppm/
Q =
50ppm/
R =
100ppm/
(3) Nominal resistance value :
For example -
Three digits of number (E-24 Series)
100 = 10
102 = 1k
Four digits of number (E-96 Series)
11R3 = 11.3
1131 =1.13k
(4) Resistance tolerance :
B =
0.1%
D =
0.5%
(5) N = Sn plating (Lead free , RoHS Compliant)

3. Electrical Specifications
Power Rating*
1/10 W
Resistance Values
E-24 series , E-96 series
Resistance Tolerance
0.5%(D)
0.1%(B) , 0.5%(D)
Resistance Range
10
91 10033k 36k360k
T.C.R. (Temperature Coefficient of
Resistance)
50ppm
25ppm
25ppm
100ppm
Operating Temperature Range
-55 to 125
Max. Operating Voltage**
75V
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 2 OF 11
Note: *Package Power Temperature Derating Curve











Note: **Resistors shall have a rated DC or AC(rms.) continuous operating voltage corresponding to the
power rating, as calculated from the following formula
Where V
: Rated voltage (V)
P
: Rated power (W)
R
P
V
=
R
: Nominal resistance (
)
If the voltage so obtained exceeds the maximum operating voltage, this maximum voltage shall
be the rated voltage.
4. Outline dimensions










Code Letter
Dimension
L
1.6
0.2
W
0.8
0.2
t
0.4
0.1
a
0.3
0.2
Unit : mm
L
W
a
a
t
-55
100
70
0
125
RA
TED LOAD
(
%
)
AMBIENT TEMPERATURE()
Figure 1.Power Temperature Derating Cure
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 3 OF 11
5. Marking
A rated resistance shall be marked on the protecting coat with three digits of number.
(1) Resistance in E-24 Series :
Example :
3.9k39 X 10
2
392
(2) Resistance in E-96 Series :
code R
value code R
value code R
value code R
value
01 100 25 178 49 316 73 562
02 102 26 182 50 324 74 576
03 105 27 187 51 332 75 590
04 107 28 191 52 340 76 604
05 110 29 196 53 348 77 619
06 113 30 200 54 357 78 634
07 115 31 205 55 365 79 649
08 118 32 210 56 374 80 665
09 121 33 215 57 383 81 681
10 124 34 221 58 392 82 698
11 127 35 226 59 402 83 715
12 130 36 232 60 412 84 732
13 133 37 237 61 422 85 750
14 137 38 243 62 432 86 768
15 140 39 249 63 442 87 787
16 143 40 255 64 453 88 806
17 147 41 261 65 464 89 825
18 150 42 267 66 475 90 845
19 154 43 274 67 487 91 866
20 158 44 280 68 499 92 887
21 162 45 287 69 511 93 909
22 165 46 294 70 523 94 931
23 169 47 301 71 536 95 953
24 174 48 309 72 549 96 976
This table shows the first two digits for the three-digits E-96 series part marking scheme.
The third character is a letter multiplier:
S=10
-2
R=10
-1
A=10
0
H=10
1
C=10
2
D=10
3
E=10
4
F=10
5
Example :
10.2k102 X 10
2
02C
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 4 OF 11
6. Life Tests
6-1 Electrical
Item
Specification and Requirement
Test Method
Short Time Overload R:
(0.5%+ 0.05)
Without damage by flashover, spark,
arcing, burning or breakdown
(1) Applied voltage :
2.5 x rated voltage or
2 x maximum operating voltage
which ever is less
(2) Test time : 5 seconds
Insulation Resistance Over 100 M
on Overcoat layer face
up
Over 1,000 M
on Substrate side face
up
(1) Setup as figure 2
(2) Test voltage : 100 V
DC
(3) Test time :
60 + 10 / -0 seconds
Voltage Proof
R:
(0.5%+ 0.05)
Without damage by flashover, spark,
arcing, burning or breakdown
(1) Setup as figure 2
(2) Test voltage : 100 V
AC
(rms.)
(3) Test time :
60 +10 / -0 seconds
Insulation Plate
Spring
Sample Electrode
Metal Block
Measurement Point B
Pressure Rod
(Metal)
Measurement Point A
Substrate
Over coat Film
Figure 2 : Measurement Setup
(R=0.5 mm)
A
B
Voltage Supply
Substrate Side
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 5 OF 11
6-2 Mechanical
Item
Specification and Requirement
Test Method
Solderability
The surface of terminal immersed shall
be minimum of 95% covered with a
new coating of solder
Solder bath :
After immersing in flux, dip in
245
5 molten solder bath for
3
0.5 seconds
Resistance to Solder
Heat
R:
(0.5%+ 0.05)
Without distinct deformation in
appearance
(1) Pre-heat : 100~110
for 30 seconds
(2) Immersed at solder bath of
270
5 for 10 1 seconds
(3) Measuring resistance
1 hour after test
Vibration
R:
(0.5%+ 0.05)
Without mechanical damage such as
break
(1) Vibration frequency :
10Hz to 55Hz to10Hz
in 60 seconds as a period
(2) Vibration time : period cycled
for 2 hours in each of 3 mutual
perpendicular directions
(3) Amplitude : 1.5mm
Shock
R:
(0.25%+ 0.05)
Without mechanical damage such as
break
(1) Peak value : 490N
(2) Duration of pulse : 11ms
3 times in each positive and
negative direction of 3 mutual
perpendicular directions
Bending Test
R:
(0.5%+ 0.05)
Without mechanical damage such as
break
Bending value : 3 mm
for 30
1 seconds
Solvent Resistance Marking should be legible
Without mechanical and distinct
damage in appearance
(1) Solvent :
Trichloroethane
or Isopropyl alcohol
(2) Immersed in solvent at
room temperature for
90 seconds
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 6 OF 11
6-3 Endurance
Item
Specification and Requirement
Test Method
Rapid change of
Temperature
R:
(0.5%+ 0.05)
Without distinct damage in appearance
(1) Repeat 5 cycle as follow :
(-55
3,30minutes) (Room
temperature, 2~3 minutes)
(+125 2,30minutes)
(Room temperature, 2~3 minutes)
(2) Measuring resistance
1 hour after test
Moisture with Load R:
(1.0%+ 0.05)
Without distinct damage in
appearance
Marking should be legible
(1) Environment condition :
40
2,90~95% RH
(2) Applied Voltage :
rated voltage
(3) Test period: (1.5 hour ON)
(0.5 hour OFF) cycled for
total 1,000 + 48 / - 0 hours
(4) Measuring resistance
1 hour after test
Load Life
R:
(1.0%+ 0.05)
Without distinct damage in appearance
(1) Test temperature :
70
2
(2) Applied Voltage :
rated voltage
(3) Test period: (1.5 hour ON)
(0.5 hour OFF) cycled for
total 1,000 + 48 / - 0 hours
(4) Measuring resistance
1 hour after test
Low Temperature
Store
R:
(1.0%+ 0.05)
Without distinct damage in appearance
(1) Sto
e temperature :
-55
3 for total
1,000 + 48 / - 0 hours
(2) Measuring resistance
1 hour after test
High Temperature
Store
R:
(1.0%+ 0.05)
Without distinct damage in appearance
(1) Store temperature :
+125
2 for total
1,000 + 48 / - 0 hours
(2) Measuring resistance
1 hour after test
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 7 OF 11
7. Recommend Land Pattern Dimensions







A 0.8
B 2.2
C 0.6~1.0
Unit : mm
C
A
B
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 8 OF 11
8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions










8-1-2 Reel dimensions
P(PITCH) = 4.0 0.1
P
0.65 0.1
Chip
A = 1.1 0.1
B = 1.9 0.1
A
B
0.6 0.05
1.5
+
0.1
-
0.0
1.75 0.1
3.5 0.05
8.0 0.3
2.0 0.05
Unit : mm
Carries cavity
P
Sprocket hole
21 0.8
13 0.2
13 1.4
9 0.3
178 2.0
R1
2 0.5
105
Unit : mm
60
+1 -0
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 9 OF 11
8-2 Peel force of top cover tape
The peel speed shall be about 300 mm/minute
The peel force of top cover tape shall be between 0.1 to 0.7 N
8-3 Numbers of taping
5,000 pieces/reel
8-4 Label marking
The following items shall be marked on the production and shipping
Label on the reel.
8-4-1 Production Label
(1) Part No.
(2) Description
(3) Quantity
(4) Taping No.
8-4-2 Shipping Label
(1) *Customer's name
(2) *Customer's part No.
(3) Manufacturer's part No.
(4) Manufacturer's name
(5) Manufacturer's country
*Note : Item (1) and (2) are listed by request
165~180
Top Cover Tape
0.1N~0.7N
CYNTEC CO., LTD.
DOCUMENT : RB000000N
REVISION : A1
PAGE : 10 OF 11
9. Care note
9-1 Care note for storage
(1) Chip resistor shall be stored in a room where temperature and humidity must be controlled.
(temperature 5 to 35, humidity 45 to 85% RH) However, a humidity keep it low, as it is
possible.
(2) Chip resistor shall be stored as direct sunshine doesn't hit on it.
(3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability
inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfuration
hydrogen)
9-2 Care note for operating and handling
(1) It is necessary to protect the edge and protection coat of resistors from mechanical stress.
(2) Handle with care when printing circuit board (PCB) is divided or fixed on support body,
because bending of printing circuit board (PCB) mounting will make mechanical stress for
resistors.
(3) Resistors shall be used with in rated range shown in specification. Especially, if voltage
more than specified value will be loaded to resistor, there is a case it will make damage for
machine because of temperature rise depending on generating of heat, and increase
resistance value or breaks.
(4) In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a
resistor and to reduce a load power according to load reduction curve, because a
temperature rise of a resistor depends on influence of heat from mounting density and
neighboring element.
(5) Observe Limiting element voltage and maximum overload voltage specified in each
specification
(6) If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it
is necessary that operating condition shall be set up before use.
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