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Datasheet: RG1005(0402) (Cyntec Co., Ltd.)

Thin Film Chip Resistor

 

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CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 1 OF 14
1005 Series Thin Film Chip Resistor
1.
Scope
This specification applies to fixed metal film chip resistors rectangular type.High precision and
reliability
2.
Type Designation
RG1005
N
T*
(1)
(2)
(3)
(4)
(5)
(6)
Where
(1)
Series No.
RG : Fixed metal film chip resistors rectangular
type (Reliability type)
1005 : 1.0 0.5mm
(2)
Temperature coefficient of resistanceT.C.R.
V : 5ppm/
N : 10ppm/
P : 25ppm/
R : 100ppm/
(3)
Resistance value:
For example--
Three digits of number (E-24 Series)
103 = 10
10
3
=10k
Four digits of number (E-96 Series)
4992 = 49910
2
=49.9k
Note: however following
rsistance value in E96 series
are appropriated as value of
E24 series.
1010
x
1110
x
130
x
1510
x
2010
x
750
x
(4)
Resistance tolerance:
P = 0.02%
W = 0.05%
B = 0.1%
C = 0.25%
D = 0.5%
(5)
N=Sn plating (Lead free , RoHS Compliant)
(6)
Quantity in taping
T1 : 1,000pcs/reel
T5 : 5,000pcs/reel
T10 : 10,000pcs/reel
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 2 OF 14
3. Physical Dimensions
Figure 1. Dimensions
4. Ratings
4-1
Specification
Resistance rang and Ratings (R: Rated resistance)
Type
Temperature
coefficient of
resistance
0.02%(Code:P) 0.05%(Code:W)
0.1%(Code:B)
0.25%(Code:C)
0.5%(Code:D)
5 ppm/(Code:V)
100 R<3k
10 ppm/(Code:N) 100 R<3k
47 R100k
25 ppm/(Code:P)
100 R<3k
47 R100k
RG1005
100 ppm/(Code:R)
10 R47
4-2
Rated dissipation at 85
1/3W
Rated dissipation is based on continuous full load operation at rated ambient temperature of 85.
For the resistor operated at ambient temperature in excess of 85, the maximum load shall be
derated in accordance with the following curve.
Rated dissipation
Stability
Type :1005
A
0.063W
B
0.032W
b
b
t
L
a
W
a
Code
Letter
Dimensions (mm)
L
1.00 0.05
W
0.5 0.05
t
0.35 0.05
a
0.20 0.10
b
0.25 0.05
Note :
Resistive clement
Nickel alloy film
Electrode
plating
Sn100%(Lead-Free)
Protective coat
Epoxy Resin coating
Substrate
Alumina ceramic
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 3 OF 14










4-3
Rated voltage
The d.c. or a.c. r.m.s. voltage shall be calculated from the following expression.
P
R
E
=
Where ERated voltage (V)
RNominal resistance value ()
PRated dissipation (W)
Limiting element voltage: 25V
Maximum overload voltage: 50V
4-4
Category temperature range
(1)
Upper category temperature : + 125
(2) Lower category temperature : -55
5.
Marking
Type
E24 series
E96 series and Except for the
preferred number series
RG 1005
No marking on the resistor
No marking on the resistor
P
c
r
c
c
n
t

o
f

t
h
e

r
a
t
c
d

d
i
s
s
i
p
a
t
i
o
n
AMBIENT TEMPERATURE(
)
0
-55
85
155
100
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 4 OF 14
6. Performance
The test method shall be as specified in IEC 60115-1.or JIS C 5201-1.
Standard atmospheric conditions
Unless otherwise specified, the standard range of atmospheric conditions for marking measurements
tests is as follows;
Temperature
5 to 35
Relative humidity
45 to 85%RH
Air pressure
86 to 106kPa
If there is any doubt about results, measurements shall be made within the following limits;
Temperature
20 2
Relative humidity
60 to 70%RH
Air pressure
86 to 106kPa
6-1
Electrical
Item
Conditions
Specifications
Resistance and
tolerance
Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.5 Not exceed the specified
tolerance on rated
resistance in paragraph
4.1 . (2).
Temperature
characteristic of
resistance
Resistance shall be measured under standard
atmospheric conditions.
When the temperature reaches and is maintained at
100 higher than the temperature of standard
atmospheric conditions, resistance shall be measured
again. The measurement shall be made after a period
of 30 minutes, after each specified temperature is
reached.
Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.8
Not exceed the specified
temperature coefficient
of resistance in
paragraph 4.1. (3).
Overload
A d.c. or a.c. r.m.s. voltage of 2.5 times the rated
voltage shall be applied for 5 sec.
For other procedures,
Refer to IEC 60115-1(JIS C 5201-1), Sub-clause
4.13.
Change in resistance:
Under 47
(0.1%+0.01)
47 and more
(0.05%+0.01)
Without damage by flash
over (spark, arcing),
burning or breakdown
etc.
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 5 OF 14
R0.25mm~R0.5mm
Insulation plate
Measurement Point A on metallic block
Insulating enclosure surface
Spring
Specimen
Measurement Point B
on metallic plate
Item
Conditions
Specifications
Insulation
Resistance
Place the specimen on the groove of metal plate so
that the edge of metal block positions almost center
of both electrodes, with the surface of insulation
enclosure located downward or upward and
pressurize the block by a force or 1.0 0.2N.
The test voltage shall be 100 15V
dc
, and maintain
this voltage for about 1 minute. The insulation
resistance shall then be measured while applying the
voltage.











Figure 2 : Measurement Setup


Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.6
(1)
Between Electrode
and insulating
enclosure.
100M or more
(2)
Between Electrode
and base material
1,000M or more
Voltage Proof
The specimen shall be tested as Figure 2.
The test voltage shall be a voltage of 100V (a.c.
r.m.s.) between both electrode.
The voltage is gradually increased at a rate of about
100 V/s. from almost 0 V to the specified voltage
and maintained as it is for 60 5 seconds, then
gradually decreased to almost 0 V.
Refer to IEC 60115-1(JIS C 5201-1), Sub-clause 4.7
Change in resistance:
Under 47
(0.1%+0.01)
47 and more
(0.05%+0.01)
Without damage by flash
over (spark, arcing),
burning or breakdown
etc.
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 6 OF 14
45
Within 2mm
Specimen
20
R230
Press Jig
45
Testing board A
( 5)
Supports
Solder
50
A
m
p
l
i
t
u
d
e

o
f

b
e
n
d

3
m
m
P
r
e
s
s
u
r
e
Unit : mm
6-2
Mechanical
Item
Conditions
Specifications
Substrate
bending test
Pressurizing jig:12 in IEC 60115-1(JIS C 5201-1),
Sub-clause 4.33.
The amount of bend: 3 mm
The board A shall be used.
For other procedures ,














Refer to IEC 60115-1, Sub-clause 4.33
Change in resistance:
Under 47
(0.1%+0.01)
47 and more
(0.05%+0.01)
Without damage by flash
over (spark, arcing),
burning or breakdown
etc.
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 7 OF 14
Item
Conditions
Specifications
Solderability
Temperature of solder
235 5 (Solder alloy:Sn-37Pb)
245 5 (Solder alloy:Sn-3Ag-0.5Cu)
Duration of immersion : 2 0.5 seconds
For other procedures, refer to IEC 60115-1, (JIS C
5201-1) Sub-clause 4.17.
A new uniform coating
of 95% of the surface
being immersed.
Resistance to
Soldering Heat
(1)
Solder bath method
Pre-heat : 100 to 110 30 seconds
Temperature : 270 5 10 1seconds
(2)
Reflow Soldering method
Peak temperature : 260 5 10seconds or less
Temperature : 220 5 60 seconds max.
2cycles or less
The temperature shall be board surface
temperature
(3)
Soldering iron method
Bit temperature : 350 5
Time : 3 +1/-0 seconds
The specimen shall be stored at standard
atmospheric conditions for 1hour after which the
measurement shall be made.
For other procedures, refer to IEC 60115-1, (JIS C
5201-1)Sub-clause 4.18.
Change in resistance:
Under 47
(0.1%+0.01)
47 and more
(0.05%+0.01)
Without damage by flash
over (spark, arcing),
burning or breakdown
etc.
Endurance at
upper category
temperature
The specimen shall be placed in test chamber at
155 2 with no load for 1,000 + 48 / - 0 hours.
For other procedures, refer to IEC 60115-1, (JIS C
5201-1)Sub-clause 4.25.3.
Change in resistance:
Under 47
(0.25%+0.05)
47 and more
(0.1%+0.01)
Without mechanical
damage in appearance.
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 8 OF 14
6-3
Endurance
Item
Conditions
Specifications
The specimen shall be subjected to 3 continuous
cycles, each as shown in the figure below.
Temperature
Time
1
2
3
4
55 3
Room temperature
125 2
Room temperature
30 minutes
2 3minutes
30 minutes
2 3minutes
Rapid change of
temperature
Use for Testing board B
For other procedures, refer to IEC 60115-1, (JIS C
5201-1)Sub-clause 4.19
Change in resistance:
Under 47
(0.1%+0.01)
47 and more
(0.05%+0.01)
Without damage by flash
over (spark, arcing),
burning or breakdown
etc.
Stability(*1)
Change in resistance:
A
Under 47
(0.5%+0.05)
47 and more
(0.25%+0.05)
Temperature : 85 2
Subjected to a voltage cycle
consisting of rated d.c. voltage
application of 1 hr 30 min and
rest of 30 min repeatedly for
1,000 + 48 / - 0 hours.
However the applied voltage
shall not exceed the limited
element voltage.
B
Under 47
(0.25%+0.05)
47 and more
(0.1%+0.01)
Endurance
(Rated load)
For other procedures, refer to IEC 60115-1, (JIS C
5201-1)Sub-clause 4.25.
Without mechanical
damage in appearance.
Stability(*1)
Change in resistance:
A
Under 47
(0.5%+0.05)
47 and more
(0.25%+0.05)
Temperature : 85 2
Humidity: 85 5%RH
Subjected to a voltage cycle
consisting of 10% rated d.c.
voltage application of 1 hr 30
min and rest of 30 min repeatedly
for 1,000 + 48 / - 0 hours.
However the applied voltage
shall not exceed the limited
element voltage.
B
Under 47
(0.25%+0.05)
47 and more
(0.1%+0.01)
Endurance
(Temperature
Humidity Bias)
For other procedures, refer to IEC 60115-1, (JIS C
5201-1)Sub-clause 4.24.
Without mechanical
damage in appearance.
(*1) : See Para.4.2 Ratings
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 9 OF 14
Unit : mm
100
a
f
c
b
4
0
4.5
Land
Solder resist
Mounting Method
(1)
Mounting method according to solder bath method
Epoxy based adhesive agent shall be applied in the middle of two lands of the test board.
The specimen shall be mounted in such a way that the electrode of specimen will be evenly
placed in the land area and then adhesive agent shall be cured.
After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by
dipping into a molten solder bath with 260 5 for 3 to 5 seconds
(2)
Mounting method according to reflow soldering method
About 100~150 m of Sn-3Ag-0.5Cu solder cream is applied in the land portion of the test boards
and the resistor shall be mounted in such a way so that the resistor's electrodes will be
evenly placed on the land. It is soldered under the conditions of board surface temperature d
240 5(peak temperature) for 5 to 10 seconds in an upper-portion heated oven.
Test Board
Test Board A (For substrate banding, adhesion test, see Fig.3)
Material :Glass fabric base epoxy resin 1.6mm
Copper foil ,thickness 0.035mm, Solder resist coated
(1)
Test board A (For substrate bending test)
a
b
c
f
0.5
1.6
0.6
(1.5)
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 10 OF 14
(2)
Test board B ( For another test )
Material :Glass fabric base epoxy resin 1.6mm
Copper foil ,thickness 0.035mm, Solder resist coated
a
b
c
f
0.5
1.6
0.6
(5)
b
2
5
7
.
5
5
.
5
a
f
3
.
5
3
c
58.5
5.08
5.08
2.5
3
Unit : mm
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 11 OF 14
7.
Packaging
7-1
Dimensions
7-1-1
Tape packaging dimensions
Code letter
RG 1005
T
0.430.05
a
0.630.05
b
1.130.05
Pre-emptied holes150 holes (or 30cm) or more.
0.0
0.1
Carrier cavity
Chip
A
B
0.43 0.05
1.5
1.75 0.1
8.0 0.3
2.0 0.05
4.0 0.1
Unit : mm
Pull Direction
3.5 0.05
Sprocket hole
4.0 0.1
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 12 OF 14
7-1-2.
Tape packaging dimensions
7-2. Quantity per reel
Type
Tolerance
Code
RG 1005
0.02%
T1
1,000 pcs
T1
1,000 pcs
0.05%,0.1%
T5
5,000 pcs
T5
-
0.25%,0.5%
T10
10000 pcs
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 13 OF 14
7-3.
Label Making
The label indicated following items shall be marked on single side of the reel.
(1)
Type designation .
(2)
Quantity
(3)
Manufacturing date code
(4)
Manufacturer's name
(5)
The country of origin
(6)
Shipping number
8.
Precautions in use
8-1
Storage
(1)
The product shall be stored in a room temperature and humidity must be controlled.
( temperature 5 to 35, humidity 45 to 85%RH )
(2)
The product shall be stored as direct sunshine doesn't hit on it.
(3)
The product shall be stored with no moisture, dust, a material that will make Solder ability inferior,
and a harmful gas (hydrogen chloride, sulfurous acid gas, and hydrogen sulfide).
(4) Resistor shall be stored with keeping the minimum package unit with uncivilized sealed ( Keep the
state of the taping).
8-2
Time limit to storage
(1)
The storage time limit of the product is reckoned on the day when product was shipped by our
company and made within one year.
(2)
Confirm solder ability beforehand when you use the one that the time limit was passed.
8-3
Chip mounting
(1)
When chip are mounted on the PC board, the protective coat of the product must not be scratched. If
it will be scratched, it will make characteristic inferior.
(2)
In case that product will be soldered by soldering iron, heating shall be done on the land, and
soldering iron must not hit in the product itself.
(3)
In case that resin coating or resin seal will be made for a PC board after chip mounting, do washing
and drying it enough before coating or sealing. If ion bear or moisture will be sealed in resin coating,
it will make characteristic inferior.
For resinous use, it is necessary to set up enough the curing conditions. As it gets improper for the
condition, changes of a resistance value are large and are a case.
(4)
According to shape, material, and pressure of clamping in chip mounting machine, there is the case
that crack will be appeared on the product.
Control a shock energy for clamping the product under 7 10
-4
J
With a shock energy around clamping that says here, it is suited to a potential energy, in case that iron
block of 25g is dropped naturally to the product placed on iron plate for the height of 2.8mm.
(5)
The glue to fix the product on the PC board around chip mounting, it is needed high insulation
resistance and great performance or moisture. And it is needed that these characteristic are not inferior
in using temperature range and a hot spot temperature to be acting.
CYNTEC CO., LTD.
DOCUMENT : RGA00000N
REVISION : A0
PAGE : 14 OF 14
8-4.
Using and Handling
(1) Use under the special environment
Performance and reliability are fully researched in advance, and it must be confirmed when a use part
under the special environment is used with the special environment .There is the following thing in the
special environment.
1Water, salt water, oil, the inside of acid, alkali, the liquid such as an organic solvent or the place
where it reaches it
2The place where direct sunlight hits it, an exposure in the open air, the inside of the dust
3The condensation
4The place where harmful gas(in such cases as the sea breeze,HCl,Cl
2
,SO
2
,NH
3
,NO
X
) is abundant.
Water or ion quality sometimes reaches even a body and an electrode by the protection material of
the resistor being eroded gradually under the above environment. Then investigation confirmation
is necessary because resistance value may change due to the chemical reaction such as electrolysis.
(2)
Use under the high temperature environment
When components are used under the high temperature environment, load electric power must be
reduced based on the reduction curve prescribed in every kind.
(3)
Investigate the performance and reliability enough when using under harsh environment.
(4)
Protect the edge and protection coat of resistors from mechanical stress.
(5)
Handle with care when PC board is divided or fixed on support body, because bending of PC board after
chip mounting will make mechanical stress for resistors.
(6)
Resistors shall be used with in rated range shown in specification.
Especially. If voltage more than specified value will be loaded to resistor, there is a case it will make
damage for machine because of temperature rise depending on generation of heat, and increase value or
breaks.
(7)
In case that resistors is loaded voltage, it is necessary to confirm temperature of resistor and to reduce a
load power according to load reduction curve, because a temperature rise of a resistor depends on
influence of heat from mounting density and neighboring element.
(8)
Observe Limiting element voltage and maximum overload voltage specified in each specification.
(9)
If there is a possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, If is
necessary that operating condition shall be set up before use, because performance of thin film resistor is
affected by a large shock voltage.
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