HTML datasheet архив (поиск документации на электронные компоненты) Поиск даташита (1.687.043 компонентов)
Где искать

Datasheet: IM13400E (Cyntec Co., Ltd.)

Intelligent Power Module (LDIP) - 20A

 

Скачать: PDF   ZIP
 

Document Outline

PAGE 1 OF 14
LDIP- IPM IM13400
Description
Cyntec IPM is integrated Drive, protection and system
control functions that is designed for high performance 3-phase
motor driver application like:
Home appliances applications.
Inverter drive parts for AC/DC motor driving.
Features
UL Certified No.E204652.
Lower switching loss and higher short-circuit withstanding capability.
Under-voltage lockout protection.
Using copper as the heat-sink to withstand the power semiconductor to get the lower thermal
resistance.
Matched propagation delay for three arms to get balance switching performance.
Provided a fault signal (FO pin) and shut-off internal IGBT, when OC/SC and under-voltage
situation are occurred.
2500 Vrms isolation rating.
Lead-Free packaging and RoSH compatible.
1
1
1~
5
St
and
of
f
l
r
rgu
l
o
r

s
ol
d
e
r
re
mai
n
s
St
and
of
f
l
r
rg
ul
or
s
ol
der

r
e
ma
i
n
s
1 HIN1
2 V
CC
3 V
B1
4 V
S1
5 HIN2
6 V
CC
7 V
B2
8 V
S2
9 HIN3
10 V
CC
11 GND
12 V
B3
13 V
S3
14 V
CC
15 GND
16 CIN
17 CFO
18 FO
19 LIN1
20 LIN2
21 LIN3
22 P
23 U
24 V
25 W
26 N
TERMINAL CODE
HEAT SINK SIDE
Detail A
Detail B
(t=0.7)
Detail C
(t=0.7)
Figure 1. Package Outlines
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 2 OF 14
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
Table1: Pin Descriptions
No. Symbol
Pin Description
1
HIN1
Signal Input Terminal for High-side U Phase
2 V
CC
Supply Voltage Terminal for Driver IC
3 V
B1
High -side Bias Voltage for U Phase IGBT Driving
4 V
S1
High -side Bias Voltage Ground for U Phase IGBT Driving
5
HIN2
Signal Input Terminal for High-side V Phase
6 V
CC
Supply Voltage Terminal for Driver IC
7 V
B2
High -side Bias Voltage for V Phase IGBT Driving
8 V
S2
High -side Bias Voltage Ground for V Phase IGBT Driving
9
HIN3
Signal Input Terminal for High-side W Phase
10 V
CC
Supply Voltage Terminal for Driver IC
11 GND
Signal Ground
12 V
B3
High -side Bias Voltage for W Phase IGBT Driving
13 V
S3
High -side Bias Voltage Ground for W Phase IGBT Driving
14 V
CC
Supply Voltage Terminal for Driver IC
15 GND
Signal
Ground
16 CIN
Comparator
Input
17
CFO
Capacitor for Fault Output Duration Time Selection
18 FO
Fault
Output
Terminal
19
LIN1
Signal Input Terminal for Low-side U Phase
20
LIN2
Signal Input Terminal for Low-side V Phase
21
LIN3
Signal Input Terminal for Low-side W Phase
22
P
Positive DC-Bus Input Terminal
23
U
Output Terminal for U Phase
24
V
Output Terminal for V Phase
25
W
Output Terminal for W Phase
26
N
Negative DC-Bus Input Terminal
PAGE 3 OF 14

LDIP-IPM Internal Block Diagram
Figure. 2 LDIP-IPM Internal Block Diagram


TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 4 OF 14
MAXIMUM RATINGS
(T
j
= 25)
INVERTER PART
Item Symbol
Min.
Max.
Unit
Between collector to emitter voltage
V
CES
- 600
V
Supply voltage P-N
V
PN
- 450
V
Supply voltage (surge) P-N
V
PN (surge)
- 500
V
Each IGBT collector current
I
C
( Tc =
25
) -
20
A
Each IGBT collector current (peak)
I
CP
( Tc =
25 , pulse
) - 40 A
Collector dissipation
P
C
(Tc =
25, per one chip
) -
93 W
Junction temperature
T
j
(Note 1)
-20
+125
Note 1The maximum junction temperature rating of the power chip integrated within the IPM is 150C (@ Tc 100C). However, It
would be recommended that the average junction temperature should be limited to T
j
125C (@ Tc 100C) in order to
guarantee safe operation.
CONTROL PART
Item Symbol
Min.
Max.
Unit
Driver IC supply voltage
V
CC
-0.3 20 V
P- side floating supply voltage
V
B1S1,B2S2,B3S3
-0.3 20 V
Current sensing input voltage
V
CIN
-0.3 Vcc+0.3 V
Logic input voltage
HIN1,HIN2,HIN3,
LIN1,LIN2,LIN3
-0.3 5.5 V
Fault output voltage
V
FO
-0.3 Vcc+0.3 V
Fault output current
I
FO
- 10
mA
TOTAL SYSTEM
Item Symbol
Min.
Max.
Unit
Module case operating temperature
T
C
(Note 2)
-20 +100
Storage temperature
T
stg
-40 +125
Isolation voltage (60Hz Sinusoidal, AC 1 min.,
pins to heat-sink plate)
V
iso
- 2500
Vrms
Note 2: Tc Measurement Point.
Heat sink
Tc
Control Terminals
Power Terminals
Tc
Heat sink boundary
Figure.3 Tc measurement point
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 5 OF 14

ELECTRICAL CHARACTERISTICS
(T
j
= 25
)
INVERTER PART
Item Symbol
Condition Min.
Typ.
Max.
Unit
Collector-emitter saturation
voltage
V
CE
(sat)
V
CC
=V
B1S1
,B2S2,B3S3
=15V,
I
C
=20A, V
CIN
= 0V, T
j
=25
- 2.60
3.10
V
FWD forward voltage drop
V
F
T
j
=25, - I
C
= 20A,V
CIN
=5V -
1.90
2.40
V
T
on
- 0.80
1.30
T
r
- 0.07
0.12
T
off
- 1.00
1.60
Switching times
T
f
V
D
=300V,
V
CC
=V
B1S1,B2S2,B3S3
=15V,
I
C
=20A,T
j
=25,
V
HIN
=5V<> 0V,
V
CIN
= 0V, inductive Load
- 0.06
0.30
s
Collector-emitter cut-off current
I
CES
V
CE
=V
CES
- -
0.09
mA


TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.














Figure.4 Switching time define














PAGE 6 OF 14
CONTROL PART
(T
j
= 25)
Item Symbol Condition Min.
Typ.
Max. Unit
HIN1,2,3 , LIN1,2,3 ON
threshold voltage
V
th(on)
1.4
1.7
2.0
V
HIN1,2,3 , LIN1,2,3 OFF
threshold voltage
V
th(off)
2.2
2.5
2.8
V
I
HIN(HI)
V
HIN1,2,3
= 5V
-
-
220
HIN1,2,3 input current
I
HIN(LO)
V
HIN1,2,3
= 0V
-
-
300
A
I
LIN(HI)
V
LIN1,2,3
= 5V
-
-
220
LIN1,2,3 input current
I
LIN(LO)
V
LIN1,2,3
= 0V
-
-
300
A
Driver IC supply voltage
V
CC
13.5
15.0
16.5
V
P- side floating supply
voltage
V
B1S1,B2S2,B3S3
13.5
15.0
16.5
V
V
CC
terminal input current
I
C
-
-
2.3
mA
V
FOH
V
CIN
=0V (Note 3)
4.9 - - V
Fault output voltage
V
FOL
V
CIN
=1V (Note 3)
- -
200
mV
Short circuit trip level
V
SC(ref)
V
CC
=15V, T
j
= 25 0.37
0.46
0.55
V
Fault output pulse width
t
FO
C
F O
=22nF ~ 33nF (Note 4)
1.0 1.8 - ms
UVT
VCC
Trip level
10.4
10.9
11.4
V
UVR
VCC
Reset level
10.6
11.1
11.6
V
Supply circuit under voltage
Note 3 : FO output is open collector type, so this signal line should be pulled up to the +5V power supply with approximately 5.1K.
protection
UVH
Hysteresis
- 0.2 - V
HIN,LIN Input filter time
t
IN,FIL
VIN = 0 & 5 V (Note 5)
100 200 - ns
Note 4 : C
FO
need to adjust if output can not fit 1.8 ms demand.
Note 5 : For high side PWM, HIN pulse width must be 1sec.













THERMAL RESISTANCE
Item Symbol Condition Min.
Typ.
Max. Unit
R
th(j-c)
Q
IGBT part (1/6)
-
-
1.07
Junction to case thermal
resistance
R
th(j-c)
F
FWD part (1/6)
-
-
1.57
Case to fin thermal
resistance
R
th(c-f)
Case to W pin
- -
0.03
/W

TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 7 OF 14

RECOMMENDED OPERATION CONDITIONS
Item Symbol Condition Min.
Typ.
Max.
Unit
DC_ Link Supply voltage
V
D
Applied between P-N
0
300
400
V
Control supply voltage
V
CC
Applied between V
CC
- GND
13.5 15.0 16.5 V
Control supply voltage
V
B1S1,B2S2,B3S3
Applied between V
B1,2,3
V
S1,2,3
13.5 15.0 16.5 V
Input ON threshold voltage
V
CIN(ON)
0 ~ 0.65
V
Input OFF threshold voltage
V
CIN(OFF)
Applied between HIN1,2,3 - GND
and LIN1,2,3 - GND
4.0 ~ 5.5
V
Supply voltage ripple
V
D
, V
DB
-1
-
1
V/
s
Arm shoot-through blocking time
t
dead
(Note 6)
2 - -
s
PWM Input frequency
f
PWM
T
C
100, T
j
125
- 15 -
kHz
Note 6: To prevent high and low side IGBT occurred shoot-through

MECHANICAL CHARACTERISTICS AND RATINGS
Item Condition
Min.
Typ.
Max.
Unit
Mounting torque
Mounting screw : M4
0.98
1.18
1.37
N-m
Weight --
-
75
-
g
Heat-sink flatness
(Note 7)
-100 - 50
m
Note 7: Measurement point of copper heat-sink flatness.



Place to contact a heat sink
Heat sink
Heat sink
DIP-IPM
Measurement point
















Figure.6 Measurement point of heat-sink flatness
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 8 OF 14
Input/Output Timing Diagram












Figure.7 Input/Output Timing Diagram
Note 8The shaded area indicates that both high-side and low-side switches are off and therefore the half-bridge
output voltage would be determined by the direction of current flow in the load.













Figure.8 Input/Output signal circuit



TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 9 OF 14


LDIP-IPM Short-Circuit Protection Function
S1. Normal operation : IGBT ON and carrying current.
S2. Short circuit current detection (SC trigger).
S3. IGBT gate interrupt and FO signal starts.
S4. IGBT turns OFF.
S5. IGBT OFF state.
S6. FO signal reset.
S7. Normal operation.


Input Signal
Shunt R Voltage
Fault output FO
S1
S2
S3
S6
S5
S7
S3
IGBT Gate Signal
Output current Ic
S4
RC Time Constant Delay
SC Trigger Level




















Figure.9 Timing Chart of SC Operation









TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 10 OF 14

LDIP-IPM Under-Voltage Protection Function
S1. Normal operation : IGBT ON and carrying current.
S2. Under-Voltage detection.
S3. IGBT gate interrupt.
S4. IGBT OFF state.
S5. Under-Voltage reset.
S6. Normal operation.














Figure.10
Timing Chart of Under-Voltage Operation

Recommended CPU I/O interface Circuit
CPU
LDIP-IPM
HIN1,HIN2,HIN3
LIN1,LIN2,LIN3
FO
GND
5V
5.1k
680
Protection circuit state
Input Signal
Driver IC supply V
Output current Ic(A)
Fault output FO
SET
RESET
UVRV
S1
S2
S3
S4
S5
S6
UVTV
CC
CC
CC
IGBT Gate Signal
Figure.11
I/O interface Circuit
Note 9Depending on the wiring impedances and the PWM control circuit of the application's PCB,
the RC coupling at each input may be changed.
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 11 OF 14
Recommended circuit example when using a photo coupler
Microcomputer
GND
IN
5V
15V
Vcc
P
N
5V
(a) IPM input pin (high-side 3-phase and low-side 3-phase)

Microcomputer
FO
GND
5V
15V
Vcc
P
N
(b) Fault output pin
Figure.12
I/O interface Circuit when using photo coupler
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 12 OF 14


Direct Input (without Photo-Coupler) Interface Example



















Figure.13 Typical Application Circuit Interface Example with Direct Input





Component selection :
1. R1 : 5.1K
( FO output is open collector type. It is necessary to apply a resistor. )
2. R2 : 680
3. R3 : 20
( It could be adjusted depending on the PWM frequency. )
4. R4 : 100
( Recommended the time constant R4xC4 is 2
S. )
5. C1 : 100 ~ 1000pF ( Ceramic ) ( The capacitor could filter the noise, but should be careful to the dead time)
6. C2 : 10 ~ 100
F ( Electrolytic, low impendence )
7. C3 : 22nF ( Ceramic )
8. C4 : 0.02
F ( Ceramic )
9. C5 : 0.22 ~ 2
F ( Ceramic )
10. D1 : 600V/1A ( Ultra-Fast recovery diode )
11. ZD : 24V/1W Zener diode ( It is recommended to insert a Zener diode to prevent surge destruction)
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 13 OF 14
Interface Example when a Photo-Coupler is used

Figure.14 Typical Application Circuit Interface Example with Opto-Coupler
Component selection :
1.
R1 : 4.7K
2.
R2 : 150
3.
R3 : 20
( It could be adjusted depending on the PWM frequency. )
4.
R4 : 100
( Recommended the time constant R4xC4 is 2
S. )
5.
R5 : 1K
6.
R6 : 1K
7.
R7 : 1K
8.
C1 : 0.1
F
9.
C2 : 10 ~ 100
F ( Electrolytic, low impendence )
10. C3 : 22nF ( Ceramic )
11. C4 : 0.02
F ( Ceramic )
12. C5 : 0.22 ~ 2
F ( Ceramic )
13. C6 : 0.1
F
14. D1 : 600V/1A ( Ultra-Fast recovery diode )
15. Q1 : NPN transistor 2N3904
16.
U1 : Photo coupler TLP521
17.
ZD : 24V/1W Zener diode ( It is recommended to insert a Zener diode to prevent surge destruction)
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.
PAGE 14 OF 14
TITLE:
ENGINEERING SPEC. OF LDIP IPM 600V 20A
DOCUMENT
NO.
MM13400004
PAGE
REV.
A5
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON
X =
X.X =
X.XX =
ANGLES
HOLE DIA.
SCALE
X
UNIT
X
APPROVED BY
DRAWN BY
DESIGNED BY
CHECKED BY
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
CYNTEC CO., LTD.

Precautions on Electrostatic Electricity
(1) Operators must wear anti-static clothing and conductive shoes (or a leg or heel strap).
(2) Operators must wear a wrist strap grounded to earth via a resistor of about 1 M.
(3) Soldering irons must be grounded from iron tip to earth, and must be used only at low voltages.
(4) If the tweezers you use are likely to touch the device terminals, use anti-static tweezers and in particular avoid metallic tweezers. If a
charged device touches a low-resistance tool, rapid discharge can occur. When using vacuum tweezers, attach a conductive chucking
pat to the tip, and connect it to a dedicated ground used especially for anti-static purposes (suggested resistance value: 10
4
to 10
8
).
(5) Do not place devices or their containers near sources of strong electrical fields (such as above a CRT).
(6) When storing printed circuit boards which have devices mounted on them, use a board container or bag that's protected against static
charge. To avoid the occurrence of static charge or discharge due to friction, keep the boards separate from one other and do not stack
them directly on top of one another.
(7) Ensure, if possible, that any articles (such as clipboards) which are brought to any location where the level of static electricity must be
closely controlled are constructed of anti-static materials.
(8) In cases where the human body comes into direct contact with a device, be sure to wear anti-static finger covers or gloves (suggested
resistance value: 10
8
or less).
(9) Equipment safety covers installed near devices should have resistance ratings of 10
9
or less.
(10) If a wrist strap cannot be used for some reason, and there is a possibility of imparting friction to devices, use an ionizer.
© 2019 • ChipFind
Контакты
Главная страница