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Datasheet: AF40P03 (Anachip Corporation)

P-channel Enhancement Mode Power Mosfet

 

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Anachip Corporation
AF40P03
P-Channel Enhancement Mode Power MOSFET

This datasheet contains new product information. Anachip Corp. reserves the rights to modify the product specification without notice. No liability is assumed as a result of the use of
this product. No rights under any patent accompany the sale of the product.
Rev. 1.0 Aug 10, 2005
1/5
Features

-Lower On-Resistance
-Simple Drive Requirement
-Fast Switching Characteristic
-RoHS Compliant
-Pb Free Plating Product

Product Summary
BV
DSS
(V)
R
DS(ON)
(m)
I
D
(A)
-30 28 -30
Pin Assignments
3
2
1
S
D
G
(Front View)
General Description

The TO-252 package is universally preferred for all
commercial-industrial surface mount applications and
suited for low voltage applications such as DC/DC
converters.





Pin Descriptions


Pin Name
Description
S Source
G Gate
D Drain
Ordering information
A X 40P03 X X
PN
Package
Feature
F :MOSFET
D: TO-252
Packing
Blank : Tube or Bulk
A : Tape & Reel
Block Diagram
S
G
D
AF40P03
P-Channel Enhancement Mode Power MOSFET
Anachip Corp.
www.anachip.com.tw Rev. 1.0 Aug 10, 2005
2/5
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
V
DS
Drain-Source
Voltage
-30
V
V
GS
Gate-Source
Voltage
20
V
T
C
=25C -30
I
D
Continuous
Drain
Current,
V
GS
=10V
T
C
=100C -18
A
I
DM
Pulsed Drain Current
(Note 1)
-120
A
Power Dissipation
T
C
=25C 31.3
W
P
D
Linear Derating Factor
0.25
W/C
T
STG
Storage Temperature Range
-55 to 150
C
T
J
Operating Junction Temperature Range
-55 to 150
C
Thermal Data
Symbol
Parameter
Maximum
Units
R
JC
Thermal
Resistance
Junction-Case
Max.
4.0
C/W
R
JA
Thermal
Resistance
Junction-
Ambient
Max.
110
C/W
Electrical Characteristics
(T
J
=25C unless otherwise noted)
Limits
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
BV
DSS
Drain-Source
Breakdown
Voltage V
GS
=0V, I
D
=-250uA -30
- - V
BV
DSS
/T
J
Breakdown Voltage Temperature
Coefficient
Reference to 25C,
I
D
=-1mA
- -0.02 - V/C
V
GS
=-10V, I
D
=-18A -
-
28
R
DS(ON)
Static Drain-Source
On-Resistance
(Note 2)
V
GS
=-4.5V, I
D
=-14A - -
50
m
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
=-250uA -1 - - V
g
fs
Forward
Transconductance V
DS
=-10V, I
D
=-18A -
20
-
S
Drain-Source Leakage
Current(T
J
=25C)
V
DS
=-30V, V
GS
=0V -
-
-1
I
DSS
Drain-Source Leakage
Current(T
J
=150C)
V
DS
=-24V, V
GS
=0V -
-
-25
uA
I
GSS
Gate Source Leakage
V
GS
=20V -
-
100
nA
Q
g
Total
Gate
Charge
(Note 2)
-
14
22
Q
gs
Gate-Source
Charge
- 3 -
Q
gd
Gate-Drain
("Miller")
Charge
I
D
=-18A
V
DS
=-24V
V
GS
=-4.5V
- 9 -
nC
t
d(on)
Turn-On Delay Time
(Note 2)
-
12
-
t
r
Rise
Time
- 56 -
t
d(off)
Turn-Off Delay Time
-
30
-
t
f
Fall-Time
V
DS
=-15V
I
D
=-18A
R
G
=3.3, V
GS
=-10V
R
D
=0.8
- 57 -
nS
C
iss
Input
Capacitance
- 915
1465
C
oss
Output
Capacitance
- 280 -
C
rss
Reverse Transfer Capacitance
V
GS
=0V
V
DS
=-25V,
f=1.0MHz
- 195 -
pF
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
SD
Forward On Voltage
(Note 2)
I
S
=-18A, V
GS
=0V -
-
-1.2
V
t
rr
Reverse
Recovery
Time
(Note 2)
-
30
-
ns
Q
rr
Reverse
Recovery
Charge
I
S
=-18A, V
GS
=0V,
Dl/dt=-100A/s
- 21 - nC
AF40P03
P-Channel Enhancement Mode Power MOSFET
Anachip Corp.
www.anachip.com.tw Rev. 1.0 Aug 10, 2005
3/5
Note 1: Pulse width limited by safe operating area.
Note 2:
Pulse width < 300us, duty cycle < 2%.
Typical Performance Characteristics
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s.
Reverse Diode Junction Temperature
AF40P03
P-Channel Enhancement Mode Power MOSFET
Anachip Corp.
www.anachip.com.tw Rev. 1.0 Aug 10, 2005
4/5
Typical Performance Characteristics
Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area Fig10. Effective Transient Thermal Impedance
Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform
AF40P03
P-Channel Enhancement Mode Power MOSFET
Anachip Corp.
www.anachip.com.tw Rev. 1.0 Aug 10, 2005
5/5
Marking Information
TO-252
Logo
Part Number
YY : Year
WW: Nth week
X : Internal code ( Optional)
( Top View)
40P03
YYWWX
Package Information
Package Type: TO-252
D1
D
E2
E1
F
(0.1mm)
C
A2
F1
e
e
B1
A3
R: 0.127~0.381
1. All Dimensions Are in Millimeters.
2. Dimension Does Not Include Mold Protrusions.
E3

Dimensions In Millimeters
Symbol
Min.
Nom.
Max.
A2 1.80 2.30 2.80
A3 0.40 0.50 0.60
B1 0.40 0.70 1.00
D
6.00 6.50 7.00
D1 4.80 5.35 5.90
F
2.20 2.63 3.05
F1 0.50 0.85 1.20
E1 5.10 5.70 6.30
E2 0.50 1.10 1.70
E3 3.50 4.00 4.50
e
- 2.30 -
C
0.35 0.50 0.65
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