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Datasheet: 4N55 (Agilent Technologies)

Hermetically Sealed, Transistor Output Optocouplers For Analog and Digital Applications

 

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Agilent Technologies

Document Outline

1-559
5965-3002E
H
Features
Dual Marked with Device
Part Number and DESC
Drawing Number
Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five Hermetically Sealed
Package Configurations
Performance Guaranteed,
Over -55
C to +125
C
High Speed: Typically
400 kBit/s
9 MHz Bandwidth
Open Collector Output
2-18 Volt V
CC
Range
1500 Vdc Withstand Test
Voltage
High Radiation Immunity
6N135, 6N136, HCPL-2530/
-2531, Function
Compatibility
Reliability Data
Applications
Military and Space
High Reliability Systems
Vehicle Command, Control,
Life Critical Systems
Line Receivers
Switching Power Supply
Voltage Level Shifting
Hermetically Sealed, Transistor
Output Optocouplers for Analog
and Digital Applications
Technical Data
Analog Signal Ground
Isolation (see Figures 7, 8,
and 13)
Isolated Input Line Receiver
Isolated Output Line Driver
Logic Ground Isolation
Harsh Industrial
Environments
Isolation for Test
Equipment Systems
Description
These units are single, dual and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the
appropriate DESC Drawing. All
devices are manufactured and
tested on a MIL-PRF-38534
certified line and are included in
the DESC Qualified
Manufacturers List QML-38534
for Hybrid Microcircuits.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
photon detector. Separate
connections for the photodiodes
and output transistor collectors
improve the speed up to a
hundred times that of a conven-
tional phototransistor
optocoupler by reducing the
base-collector capacitance.
These devices are suitable for
wide bandwidth analog applica-
tions, as well as for interfacing
TTL to LSTTL or CMOS. Current
Transfer Ratio (CTR) is 9% mini-
mum at I
F
= 16 mA. The 18 V V
CC
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
Truth Table
(Positive Logic)
Input
Output
On (H)
L
Off (L)
H
Functional Diagram
Multiple Channel Devices
Available
VCC
GND
VO
VB
*See matrix for available extensions.
4N55*
5962-87679
HCPL-553X
HCPL-653X
HCPL-655X
5962-90854
HCPL-550X
1-560
capability will enable the designer
to interface any TTL family to
CMOS. The availability of the
base lead allows optimized gain/
bandwidth adjustment in analog
applications. The shallow depth
of the IC photodiode provides
better radiation immunity than
conventional phototransistor
couplers.
These products are also available
with the transistor base node
connected to improve common
mode noise immunity and ESD
susceptibility. In addition, higher
CTR minimums are available by
special request.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options, see Selection Guide
Table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same functional die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
similarities give justification for
the use of data obtained from one
part to represent other part's
performance for die related
reliability and certain limited
radiation test results.
Selection GuidePackage Styles and Lead Configuration Options
Package
16 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
Lead Style
Through Hole
Through Hole
Through Hole
Unformed Leads
Surface Mount
Channels
2
1
2
4
2
Common Channel Wiring
None
None
V
CC
GND
V
CC
GND
None
HP Part # & Options
Commercial
4N55*
HCPL-5500
HCPL-5530
HCPL-6550
HCPL-6530
MIL-PRF-38534, Class H
4N55/883B
HCPL-5501
HCPL-5531
HCPL-6551
HCPL-6531
MIL-PRF-38534, Class K
HCPL-257K
HCPL-550K
HCPL-553K
HCPL-655K
HCPL-653K
Standard Lead Finish
Gold Plate
Gold Plate
Gold Plate
Gold Plate
Solder Pads
Solder Dipped
Option #200
Option #200
Option #200
Butt Cut/Gold Plate
Option #100
Option #100
Option #100
Gull Wing/Soldered
Option #300
Option #300
Option #300
SMD Part #
Prescript for all below
5962-
5962-
5962-
5962-
5962-
Either Gold or Solder
8767901EX
9085401HPX
8767902PX
8767904FX
87679032X
Gold Plate
8767901EC
9085401HPC
8767902PC
8767904FC
Solder Dipped
8767901EA
9085401HPA
8767902PA
87679032A
Butt Cut/Gold Plate
8767901UC
9085401HYC
8767902YC
Butt Cut/Soldered
8767901UA
9085401HYA
8767902YA
Gull Wing/Soldered
8767901TA
9085401HXA
8767902XA
*JEDEC registered part.
8 Pin Ceramic DIP Single
Channel Schematic
ANODE
3
CATHODE
6
5
VO
GND
IO
IF
2
+
VF
8
VCC
7
VB
IB
ICC
Note base pin 7.
1-561
0.20 (0.008)
0.33 (0.013)
4.45 (0.175)
MAX.
20.06 (0.790)
20.83 (0.820)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
Functional Diagrams
16 Pin DIP
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
Through Hole
Through Hole
Through Hole
Unformed Leads
Surface Mount
2 Channels
1 Channel
2 Channels
4 Channels
2 Channels
Note: 8 pin DIP and flat pack devices have common V
CC
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages
have isolated channels with separate V
CC
and ground connections.
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
DESC SMD*
HP FSCN*
HP LOGO
COUNTRY OF MFR.
HP P/N
PIN ONE/
ESD IDENT
DESC SMD*
*QUALIFIED PARTS ONLY
Leaded Device Marking
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
COUNTRY OF MFR.
HP FSCN*
HP LOGO
DESC SMD*
PIN ONE/
ESD IDENT
HP P/N
DESC SMD*
* QUALIFIED PARTS ONLY
Leadless Device Marking
5
7
6
8
12
10
11
9
GND
V
CC2
V
B2
1
3
2
4
16
14
15
13
V
OC1
GND
V
O1
V
O2
V
B1
1
3
2
4
8
6
7
5
V
CC
GND
V
OUT
V
B
1
3
2
4
8
6
7
5
V
CC
GND
V
O2
V
O1
5
7
6
8
12
10
11
9
GND
V
O4
V
O3
1
3
2
4
16
14
15
13
V
CC
V
O2
V
O1
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
GND1
VB2
19
20
2
3
VO1
8
7
VCC2
VCC1
10
GND2
15
13
12
14
VO2
VB1 9
*QUALIFIED PARTS ONLY
1-562
Outline Drawings (contd.)
16 Pin Flat Pack, 4 Channels
8.13 (0.320)
MAX.
5.23
(0.206)
MAX.
2.29 (0.090)
MAX.
7.24 (0.285)
6.99 (0.275)
1.27 (0.050)
REF.
0.46 (0.018)
0.36 (0.014)
11.13 (0.438)
10.72 (0.422)
2.85 (0.112)
MAX.
0.89 (0.035)
0.69 (0.027)
0.31 (0.012)
0.23 (0.009)
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2
Channels
8 Pin DIP Through Hole, 1 and 2
Channel
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
1.78 (0.070)
2.03 (0.080)
0.51 (0.020)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
METALIZED
CASTILLATIONS (20 PLCS)
2.16 (0.085)
TERMINAL 1 IDENTIFIER
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1.14 (0.045)
1.40 (0.055)
1-563
0.51 (0.020)
MIN.
5.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5 MAX.
5.57 (0.180)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
Hermetic Optocoupler Options
Option
Description
100
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 and 16 pin DIP. DESC drawing part numbers contain provisions for
lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a
standard feature.
300
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below
for details). This option has solder dipped leads.
1.40 (0.055)
1.65 (0.065)
5.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
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